Shulou(Shulou.com)06/02 Report--

After the outbreak of the COVID-19 epidemic, drones and intelligent robots have been used in many areas for medical assistance and epidemic prevention and control, effectively reducing human-to-human contact and minimizing the possibility of epidemic transmission. At the same time, in the seriously ill areas, the unmanned distribution of autopilot technology has become a good way to replace manpower. Autopilot technology, which entered the cold winter of 2019, has once again become the focus of attention.

With the real experiments carried out on today's roads, the functions that self-driving cars must support are expanding, and their complexity is also increasing rapidly. These automatic systems will continuously improve the requirements for performance, power consumption, security, security and reliability, which also requires faster, more reliable and more cost-effective memory chips.

Acer has mentioned before that at present, there are three main types of memory chips in the world. DRAM is mainly used for PC memory (such as DDR) and mobile phone memory (such as LPDDR), each accounting for 30%. Non-volatile chips (after power off, the information in the memory still exists) is mainly flash memory (Nand FLASH and NOR FLASH), NOR is mainly used in code storage media, and NAND is used for data storage.

UFS, whose full name is Universal Flash Storage, is a kind of "universal flash storage". According to Hongwang Semiconductor, UFS uses serial data transmission technology, there are only two data channels but the speed exceeds eMMC. At present, UFS 3.0, which is popular in the market, has twice the bandwidth and lower power consumption of UFS 2.1s. UFS 3.0 can achieve 11.2Gb/s on a single channel and 23.2Gb/s on a dual channel. UFS 3.0 can also operate at higher temperatures, which is important to meet the specification level requirements (- 40 to 105 °C). Because at present, most embedded multimedia card (eMMC) 5.1 solutions can only meet the operating temperature of-25 to 85 °C.

UFS 3.0 includes two features designed for automotive applications, support a wide temperature range, and support refresh operations. By relocating old data to other less used units, the data refresh function can improve the reliability of the system. In addition, there are temperature warnings, including device alarms based on a predefined temperature range.

Previously, Hongwang Semiconductor has been committed to working closely with partners in the automotive industry to develop more high-quality memory solutions. UFS introduced by Hongwang Semiconductor adopts serial data transmission technology and full-duplex operation mode, the same channel allows read and write transmission, read and write can be carried out at the same time, the bandwidth has reached more than 1.5GB/s, and the transmission efficiency has been effectively improved. Therefore, whether it is data transmission technology or working mode, UFS is fully ahead of eMMC.

It is precisely because UFS has these advantages that it has become a general trend for flagship aircraft to carry UFS in the market, so UFS is much better than eMMC in all aspects. Previously, both the service life and the reading and writing speed. Hongwang believes that in order to achieve autopilot, it is necessary to add memory to the overall and integrated system of autopilot. In the future, Hongwang Semiconductor will also combine the huge demand of the automotive market to bring more high-quality and complete storage solutions.

Welcome to subscribe "Shulou Technology Information " to get latest news, interesting things and hot topics in the IT industry, and controls the hottest and latest Internet news, technology news and IT industry trends.