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T3ster is a transient thermal tester developed by Mentor Graphics Company in the United States. Based on the international standard static experimental method JESD51-1, it measures the thermal resistance and heat capacity characteristics of semiconductor electronic devices such as IGBT, MOS tube, power diode, transistor, LED, MEMS and so on. It is used for power electronics non-destructive testing and power cycle testing in new energy vehicles, transportation, industry, power electronics and other industries.

Product introduction

The basic configuration of T3ster includes the test host and the measurement control and result analysis software on the PC side, and the T3ster extended application configuration includes TeraLED, DynTIM and Power Tester 1500A.

T3ster

? The rapid and non-destructive measurement of thermal characteristics such as chip junction temperature, crust thermal resistance and internal heat capacity-thermal resistance is realized, which can be used for the calibration of electronic components and the measurement of contact thermal resistance.

? It can be used for chip defect detection or fault analysis and reliability testing of PCB solder joints.

? It can provide detailed thermal characteristic data for FloTHERM, which can help to quickly establish and modify the simulation model.

? The transient test interval of up to 1 μ s system has higher sensitivity in the market (its temperature resolution is 0.01 degrees Celsius).

TeraLED

? It has a high-precision radiation and optical measuring instrument, which can comprehensively and accurately measure the thermal characteristics of LED, including temperature, life and reliability.

? Its own software can automatically analyze luminous flux, light efficiency, efficiency and chromatic aberration coordinates, and the data can be directly imported into Flotherm/FloEFD for thermal analysis of subsequent LED lamp assembly.

DynTIM

? TIM is an advanced equipment for testing thermal characteristics of thermal interface materials (T3Ster). With T3Ster, the resolution of the test material can reach 1 μ m.

? Provide advanced TIM test scheme in the industry, its relative accuracy is up to ±5%

? It can realize the thermal test of many kinds of compressible materials, such as thermal conductive silica gel, heat dissipation pad, various phase change materials, other adhesives and solid samples, etc.

Power Tester 1500A

? It is widely used in non-destructive testing of IGBT thermal characteristics of automobiles and railways, as well as accelerated fatigue test of IGBT.

? It integrates power cycle, thermal transient test and thermal structure function analysis.

? Built-in a variety of power loading modes, such as constant power, constant temperature rise, constant current

? Real-time fault diagnosis, such as break of chip bond line, delamination and damage of materials in chip and package, aging of solder paste, etc.

? Full-cycle continuous monitoring, which can monitor the whole process from initiation to failure

? Flexible use, single channel up to 500A, three channels can be used independently or simultaneously

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