Shulou(Shulou.com)12/24 Report--

Taipei and California, USA, December 11, 2023-Huirong Technology (NasdaqGS: SIMO), the global leader in NAND flash memory master chips, today announced the appointment of a new organizational structure and leadership team to meet the growing needs of the company's global business, effective immediately.

The focus of this announcement is on the establishment of two major business groups, Terminal and Automotive Storage (Client & Automotive Storage; CAS) and Enterprise Storage and display Interface Solutions (Enterprise Storage & Display Interface Solution; ESDI), to establish a clearer and professional organizational structure, achieve faster innovation and stronger growth, and achieve the commitment to provide customers with the best solutions. The CAS business group will be responsible for consumer SSD master chips, mobile memory master chips, Ferri products and extended memory master chips. ESDI Business Group will be responsible for enterprise-class SSD master chips and display interface products.

To meet the needs of the new organizational structure, Huirong Technology has made the following adjustments in the management team:

Appointed Nelson Duann, former senior vice president of marketing and R & D, as senior vice president of CAS business group, responsible for product planning of consumer SSD master chips, mobile memory master chips, Ferri products and extended memory master chips, OEM business development and OEM project management.

Zhou Yanyi (Alex Chou) joined the company as Senior Vice President of ESDI Business Group, responsible for leading the enterprise storage team to expand the business to the data center and enterprise storage areas, and to expand the display interface business to the PC docking station market.

Robert Fan, former general manager of SMI USA, was promoted to senior vice president of global business and general manager of SMI USA, leading the global sales, FAE and marketing public relations teams.

Gou Jiazhang, General Manager of Huirong Technology, said: "with the increasing proportion of NAND applications in the consumer market, industrial control, business and enterprise level, our business expansion opportunities are growing at the same time. Through the establishment of these two full-time business groups, we will be more able to develop the most advanced master control technology and provide customers with industry-leading solutions. Today, we see a unique opportunity to expand into new markets and increase the share of our existing business. Through this new architecture, we will be able to achieve our goals faster and more effectively and drive long-term growth. "

Duan Xiting joined Huirong in 2007 and has nearly 25 years of experience in product design, development and marketing in the semiconductor industry. Previously, Duan Xiting was responsible for leading the marketing and research and development of Huirong Technology, and played a key role in leading the OEM business development of the company's mobile memory master chip and SSD master chip, helping these two product lines to become global leaders. Before joining Huirong Technology, Duan Xiting worked at Sun Microsystems, focusing on UltraSPARC microprocessor projects.

Zhou Yanyi joined Huirong Technology on December 1, 2023 and has more than 30 years of industry experience in ASIC design / application engineering, product marketing, business strategy and senior management business participation. Prior to joining Huirong Technology, Zhou Yanyi served as Senior Vice President of Synaptics, responsible for the development of wireless connectivity business and achieved remarkable success. Prior to that, he worked at Broadcom for more than 18 years as Vice President of Product Marketing for Broadcom Wireless connections, where he was responsible for enterprise networks, WiFi network solutions and client WIFI / BT / GNSS.

Robert Fan joined Huirong Technology in 2013 and served as General Manager of SMI USA until 2023. Prior to joining Huirong, he worked as an executive at Spansion, IDT and two venture capital-backed startups, and for more than nine years at Intel in key sales, marketing and management positions, and early in his career as a chip designer.

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