Shulou(Shulou.com)12/24 Report--

CTOnews.com December 12 news, according to the latest report of Ji Bang Consulting, due to Samsung's entry into the competition, TSMC's increase in production capacity, and some CSP changes in the design of these three major factors, will greatly ease the supply shortage of advanced packaging capacity.

People in the industry believe that the current global AI chip production capacity is tight, of which the main reason is the lack of advanced packaging capacity. Due to three major factors, the shortage of advanced packaging capacity is expected to end ahead of schedule.

Samsung joins the competition in addition to Meguiar and SK Hynix, Samsung is planning to promote HBM technology. Samsung expands the sales of HBM3 products by strengthening its cooperation with TSMC and being compatible with CoWoS process.

Samsung joined the TSMC OIP 3DFabric Alliance in 2022 and will expand its scope of work to provide solutions for future generations of HBM.

TSMC increases production capacity TSMC's continued cooperation with OSAT (Outsourcing Semiconductor Assembly And Test) is accelerating WoS capacity expansion.

Nvidia confirmed in a recent financial conference call that it has certified the capabilities of other CoWoS advanced packaging suppliers as backup.

The industry speculates that the certification of some of the front and rear production capacity of other CoWoS advanced packaging suppliers will help TSMC and its partners achieve the monthly CoWoS production target of about 40,000 tablets in the first quarter of next year.

Some CSP redesign industry insiders pointed out that the shortage of early AI chips was mainly due to three factors: lack of advanced packaging capacity, shortage of HBM3 memory capacity, and repeated orders from some CSP. Now, the obstacles associated with these factors are gradually being overcome.

CTOnews.com learned from the report that in addition to TSMC and Samsung's commitment to increase advanced packaging capacity, CSP is also adjusting its design, reducing the use of advanced packaging, and canceling previous repeated orders-all of which are key factors.

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