Shulou(Shulou.com)12/24 Report--

CTOnews.com, November 29, according to Reuters, in order to control the 2nm process, Japanese consortium Rapidus has to compete with TSMC and other industry leading companies, and plans to launch a global "recruitment" program to attract global semiconductor talent to revive Japan's chip industry.

Tuyuan ImecRapidus plans to start mass production of 2nm chips in Japan in 2027. While actively cooperating with IBM and Imec, the company pays close attention to the talent development strategy, recruiting industry professionals at home on the one hand and professionals abroad on the other.

Tetsuro Higashi, the 74-year-old head of Rapidus, said that recruitment would not be limited to Japan, but would be expanded globally to actively absorb relevant talent.

As of this month, Rapidus had about 250 employees, some of them interning in upstate New York, where IBM's semiconductor laboratory is located.

At present, the global chip giants TSMC and Samsung have achieved mass production capacity of 3nm chips, and are expected to achieve mass production of 2nm process in 2025. Japan's latest semiconductor production line is still at the 40nm level.

Looking at the whole world, as the next advanced process node after 3 nanometers, many countries around the world are competing for active layout.

CTOnews.com previously reported that Japanese chipmaker Rapidus and the University of Tokyo will cooperate with French semiconductor research institute Leti to develop the basic technology of a new generation of semiconductor design with 1nm linewidth.

The two sides will start personnel exchange and technology sharing next year, and French research institute Leti will contribute its expertise in chip components to build the infrastructure to supply 1nm products.

The goal of both sides is to establish the basic technology needed to design and develop semiconductors with linewidth of 1.4nm-1nm. The manufacture of 1nm products needs to be different from the traditional transistor structure, and Leti has strong strength in key technologies such as film formation in this field.

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