Shulou(Shulou.com)12/24 Report--

CTOnews.com November 28 news, according to the latest HBM market research report released by Jibang Consulting, Nvidia plans to introduce more HBM suppliers in order to improve the existing supply chain.

According to the timeline report shared in the agency's report, Nvidia received 8hi (24GB) samples from Meguiar at the end of July, 8hi (24GB) samples from SK Hynix in August, and Samsung 8hi (24GB) samples in early October this year.

Due to the tedious HBM verification process, which is expected to take two quarters, TrendForce Jibang Consulting expects Nvidia to complete the HBM3e verification of some vendors by the end of 2023 at the earliest, while the three original manufacturers are expected to complete all the verification in the first quarter of 2024.

It is worth noting that the HBM3e verification results of the original factories will also determine the final purchase weight distribution of Nvidia's HBM suppliers in 2024, but the verification has not yet been completed, so the overall purchase volume of HBM in 2024 remains to be seen.

Looking forward to 2024, observing the project progress of current AI chip suppliers, the existing products of NVIDIA 2023 high-end AI chips (using HBM) are A100 / A800 and H100 / H800, respectively. In 2024, the product portfolio (Product Portfolio) will be classified in more detail.

In addition to the above-mentioned models, the H200 with 6 HBM3e and the B100 with 8 HBM3e will be introduced, and NVIDIA's own Arm-based CPU and GPU will be integrated simultaneously, and GH200 and GB200 will be introduced.

In addition to HBM3 and HBM3e, according to TrendForce Group Consulting, HBM4 is expected to be launched in 2026, including NVIDIA and other CSP (cloud industry) in future product applications, specifications and performance will be more optimized.

Driven by the rapid development of specifications, we will see for the first time that the Logic die (also known as Base die) at the bottom of HBM uses 12nm process wafer, which will be provided by wafer foundry, so that a single HBM product needs to be combined with the cooperation of wafer foundry and memory factory.

In addition, with the improvement of customer requirements for computing efficiency, the number of layers of HBM4 stack, in addition to the existing 12hi (12 layers), will also develop to 16hi (16 layers), and the higher number of layers is also expected to drive the demand of the new stack mode hybrid bonding. The HBM4 12hi product will be launched in 2026, while the 16hi product is expected to be available in 2027.

The address of the report is attached to CTOnews.com, which can be read in depth by interested users.

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