Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens for the delivery of clues about the past. CTOnews.com, November 17, according to the Nippon Keizai Shimbun reported early this morning local time, Japanese chipmaker Rapidus and the University of Tokyo will cooperate with French semiconductor research institute Leti to jointly develop the basic technology of a new generation of semiconductor design with 1nm circuit linewidth.

According to the report, the two sides will start personnel exchanges and technology sharing from next year, and French research institute Leti will contribute its expertise in chip components to build an infrastructure for supplying 1nm products.

The goal of both sides is to establish the basic technology needed to design and develop semiconductors with linewidth of 1.4nm-1nm. The manufacture of 1nm products needs to be different from the traditional transistor structure, and Leti has strong strength in key technologies such as film formation in this field.

Compared with 2nm, 1nm technology can improve computing performance and efficiency by 10-20%. Rapidus has partnered with IBM and Belgian R & D group Imec to achieve the goal of mass production of 2nm chips by 2027, and 1nm semiconductors are expected to enter the mainstream as soon as the 2030s. At the same time, IBM is also considering cooperation with Rapidus in the field of 1nm.

According to CTOnews.com 's previous report, ASML, a large Dutch semiconductor manufacturing equipment manufacturer, will build a new technical support base in Hokkaido, Japan, before the second half of 2024. Rapidus is striving to mass-produce state-of-the-art semiconductors, and ASML will provide plant construction and maintenance inspection assistance to Rapidus, increasing its domestic staff by 40% by 2028.

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