Shulou(Shulou.com)11/24 Report--

CTOnews.com, Nov. 14, current headphones still use physical amplifiers to generate sound, which is then transmitted to our ears through a diaphragm. The origins of this technology can be traced back to more than 100 years ago, but today, xMEMS Labs has launched a new alternative, introducing Cypress ultrasonic solid-state speakers designed specifically for TWS headphones. Instead of using physical amplifiers, these speakers rely on ultrasonic pulses that are usually imperceptible to human hearing.

The key innovation of xMEMS is its ultrasonic amplitude modulation transduction (ultrasonic amplitude modulation transduction). Loudspeakers can generate ultrasonic pulses and then push them to a demodulator to convert acoustic pulses into sounds that can be heard by the user. Ultrasonic pulses provide exactly the same acoustic copy as the source signal, enabling better audio reproduction at all sound frequencies. Cypress ultrasonic speakers claim to provide better quality and more detailed sound than coil speakers, while still supporting high-resolution and spatial audio.

Each Cypress MEMS speaker is housed in a compact 6.3x6.5x 1.65mm package that provides louder and deeper bass than traditional speakers. The company claims that its new ultrasonic speakers can produce low-frequency sound pressure levels (SPL) of 140dB and can be as low as 20Hz. Another advantage is the wider ANC bandwidth, allowing headphones with Cypress MEMS speakers to eliminate more unwanted high-frequency noise around. The new speakers can also provide lower latency because they have a constant electro-acoustic conversion time.

CTOnews.com has learned from officials that xMEMS's Cypress ultrasonic speakers will be displayed on CES 2024 and mass production is expected to begin at the end of 2024. The company has not released any pricing details, but has revealed that it has reached a manufacturing partnership with TSMC, which will make them cost-competitive with mass market speakers for wireless headphones.

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