Shulou(Shulou.com)11/24 Report--

The chip defines the application, and the chip resonates with the application on the same frequency. With the Internet of everything greatly expanding the scope of chip applications and artificial intelligence creating a strong demand for high-performance computing, the semiconductor market has entered a new stage of growth. As the starting point of the semiconductor industry development chain, chip design is facing new needs and new challenges, so it is necessary to explore more innovative possibilities.

Recently, China's IC design industry annual event ICCAD (the 29th China IC Design Industry 2023th Annual meeting) was held in Guangzhou. More than 300 representative enterprises and more than 4000 elites in the industry attended the meeting, reaching an all-time high and unprecedented in scale. China's one-stop high-end IP and chip custom enabling leader-Core Technology attended with the world's first series of hard core products, such as HBM3E / 2e Combo IP, GDDR6X / 6 Combo IP, UCIe & Hipi Chiplet, and PCIe5.0 SerDes. The Vice President of Research and Development of Core IP was invited to deliver a keynote speech on "High-end SoC IP three-piece set: DDRn, SerDes, Chiplet". The innovative achievements attracted much attention and received enthusiastic response.

The ▲ ICCAD conference is unprecedented.

Hard core products are out of the circle, and the innovation strength has attracted the attention of the industry.

On the spot, a variety of high-speed interface IP and chip customized physical exhibits were unveiled in the core exhibition area. High-end SoC IP three-piece solutions such as HBM3E (8.4Gbps) / 2e Combo IP, UCIe&Hipi Chiplet, GDDR6X (24Gbps) / 6 Combo IP, LPDDR5X (10Gbps) / 5 Combo IP, DDR5/4 Combo IP, 32pm 56G SerDes (PCIe6/5/4) and other high-end SoC IP solutions were hard-core out of the ring and full of eye attraction. At the same time, the display of a full set of independent IP Fenghua series GPU, USB3.0 HUB, PCIe5.0 Retimer, HD-ISP and other nationally customized chip products are dazzling, attracting many partners to gather in the exhibition area, guests like clouds, praise like waves.

This event is also the first collective appearance of core HBM3E / 2e, UCIe Chiplet, USB3.0 HUB and other innovative products, demonstrating the strength of core technology comparable to the international top R & D capability and the pragmatic quality of tirelessly overcoming difficulties, and has been widely recognized and highly appraised by many colleagues in the industry. Core HBM3E / 2e Combo IP is the only silicon-certified HBM3E IP in China and the only HBM3E / HBM2E compatible IP in the world, providing an integrated solution of PHY, Contrller and 2.5D. After full silicon verification and mass production, it supports 2.5D package design simulation, provides strong support for the high performance and low latency of AI / ML and HPC, and can help customers improve development efficiency and reduce comprehensive costs.

▲ core exhibition area is very popular.

Sharing of cutting-edge technology and ecological win-win of empowering scientific and technological innovation

As a representative enterprise with leading innovation ability in the field of domestic high-speed interface IP, core technology has been the first market share in China's high-speed interface IP field for many years in a row, and it is the company with the most complete coverage of high-speed interface IP in China, and it is also the IP company with the most complete coverage of DDR interface technology in the world, with outstanding innovation strength, so it was invited to deliver a speech on "High-end SoC IP three-piece set: DDRn, SerDes, Chiplet" in IP and IC Design Service Forum. In his speech, the Vice President of Research and Development of Core Technology IP pointed out that as advanced technology high-end chips have become the main battlefield, high-end IP, as the upstream and bottom link, is becoming increasingly important, which is the key to improve reuse efficiency and iteration speed. In the current complex environment, IP suppliers' technology maturity, mass production experience and customization capabilities are indispensable. Core Technology 17 to focus on high-speed interface IP research and development, with a highly professional and experienced development team, in the world's major contract factories and all levels of process (including 5/3nm) comprehensive layout, has granted billions of high-end SoC chips for mass production.

Core high-end SoC IP three-piece set includes high-end DDR series (HBM3E / 2e LPDDR5X / 5ddr 6X / 6), UCIe&HiPi Chiplet series, high-speed SerDes (PCIe6/5) series, all meet international advanced standards, comprehensive protocol coverage, PHY and Controller one-stop turnkey integration, PPA scene optimization. At the same time, it covers the mainstream processes from 55nm to 3nm in major contract factories around the world, especially the advanced FinFET processes such as 12/10/8/7/6/5/3nm, which have been verified by taping and have rich records of mass production. And provide based on a full set of interface IP, covering architecture, bus / core splicing, IP integration / SoC integration of a full set of chip customization services, with high performance, high reliability, cost-effective products and full-stack customization to help more partners improve product competitiveness and enable the win-win development of the industry chain.

The keynote speech of ▲ core technology has attracted a lot of attention.

Over the years, core has been quietly researching and polishing itself, giving full play to more than 200 times of advanced process flow and billions of chip customization experience, continuous efforts in computing, storage, connection-related high-performance areas, with differentiated one-stop IP and chip customization solutions, all-round service to customers and developers around the world. At the same time, as an empowering enterprise with the courage to assume its mission and responsibility, the team of more than a thousand people continues to climb the peak of core technology, strive for excellence, put customers first, and adhere to the "hard science and technology ecology with core". Continue to create value for employees, industry and society, and create a better life in the digital age.

Grand scale, multi-core gathering, linkage industry chain development

ICCAD (IC Design Annual meeting) is one of the largest, highest-level and most influential annual industry events in the integrated circuit industry. Core Technology, as an one-stop IP and chip customization leader in China, has made an important appearance and linked the development of the industry chain. With the theme of "you are in the Bay area, Core to the Future", ICCAD 2023 is divided into four parts: the opening ceremony, the Summit Forum, seven seminars and industrial exhibitions, covering a total area of nearly 20,000 square meters. From the Ministry of Industry and Information Technology, Guangzhou Municipal people's Government, China Semiconductor Industry Association, as well as from domestic and foreign IC design enterprises and IP service manufacturers, EDA manufacturers, Foundry manufacturers, packaging and testing manufacturers, system manufacturers and other industry elites attended the meeting.

▲ ICCAD conference site

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