Shulou(Shulou.com)11/24 Report--

From November 10 to 11, the 29th Annual meeting of China IC Design Industry 2023 and Guangzhou Integrated Circuit Industry Innovation and Development Summit Forum (ICCAD) was successfully held in Guangzhou. As the top event of the domestic integrated circuit design industry, this ICCAD has attracted many leading EDA enterprises at home and abroad to participate in the meeting. Oriental Jingyuan was invited to appear in this exhibition to showcase a number of products and technologies of its manufacturing EDA. In the same period, the FOUNDRY and process Technology Forum brought wonderful speeches to share the forward-looking integrated yield solution HPOTM and the latest technology evolution achievements, which has been highly concerned by the industry.

With the continuous evolution of integrated circuit technology nodes, the process complexity is increasing, and the yield has become a great challenge. Around the improvement of yield, the industry has carried out a lot of exploration, among which the collaborative optimization of design and manufacturing process (DTCO) has become one of the mainstream solutions. The core of DTCO methodology is to enable both parties to seek better overall results from what they are good at through deep collaboration between design and manufacturing.

Since its inception, Dongfang Jingyuan has aimed at the pain point of the development of the industry, focused on the field of integrated circuit manufacturing yield management, and put forward a unique DTCO solution-HPOTM (Holistic Process Optimization) yield maximization technical route and product design concept. HPOTM takes the seamless link of nano-level testing equipment and core EDA tool chain as its core technology advantage, which can clear up the information gap between chip design and manufacturing process, improve efficiency and reduce manufacturing cost, realize the calculability, visibility, testability and seamless link of chip manufacturing process, make the chip manufacturing process from "art" to "science" to "intelligence", and finally reduce the threshold of chip manufacturing.

At ICCAD2023's FOUNDRY and process Technology Forum, Zhang Shengrui, Director of Oriental Jingyuan Strategic products, shared the topic entitled "Integrated yield solution practice: from Design manufacturability Optimization to thorough OPC Bad Point Resolution Strategy". This paper introduces the current Dongfang Jingyuan comprehensive physical design tools and OPC tools, as well as some specific practices of seeking integrated optimization results from their respective strengths, and shows how to achieve chip design and manufacturing collaborative optimization through HPOTM, so as to provide a more competitive yield improvement solution for the industry.

At the Oriental Jingyuan booth, many tools supporting HPOTM solutions are demonstrated and introduced in more detail. In the manufacturing EDA part, after its computational lithography software PanGen fills the domestic blank and leads the relevant domestic development, Dongfang Jingyuan has successfully created strict lithography simulation software PanSim, yield management software YiledBook and other manufacturing EDA tools. In the field of electron beam inspection and measurement, with three leading products: electron beam defect detection equipment EBI, key size measurement equipment CD-SEM and electron beam defect reinspection equipment DR-SEM, it has become a leader in the field of electron beam inspection and measurement in China.

In the future, Oriental Jingyuan will continue to deepen and explore more HPOTM solutions, create more tools, walk out of an independent and controllable way to create a "core", and join hands with partners in the upstream and downstream of the industrial chain to establish a new ecology suitable for China's integrated circuit industry.

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