Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens Wu Yanzu in South China for the delivery of clues! CTOnews.com November 14 news, SK Hynix vice president and co-CEO Park Zhenghao revealed that the company's high-bandwidth memory (HBM) shipments have increased significantly this year and are expected to reach 100 million pieces per year by 2030.

Yesterday afternoon, Park Zhenghao made the above remarks in a speech after the shared growth Council Golf Championship held in CC, Kwangju, Gyeonggi Province.

CTOnews.com Note: the shared growth Council is a supplier group of SK hynix. The golf tournament was organized by SK hynix Purchasing Department and attended by more than 100 people, including supplier representatives.

Park Jung-ho shared HBM's business performance and future prospects at the golf tournament. "it will be difficult on the whole due to the reduction in equipment investment, but we will tide over the difficulties together," he told the supplier representative. He also stressed that the company plans to start producing semiconductors at the Longren cluster plant in 2027 as planned.

In a third-quarter earnings call at the end of last month, SK hynix said it planned to increase next year's facility investment on top of this year. However, the company explained that as demand has not fully recovered, the scope for investment expansion will be limited and the focus will be on HBM.

The company said investment related to silicon straight-through voltage electrodes (TSV) for the production and stacking of 1b process DRAM on the next-generation HBM3E was seen as a top priority.

The market is optimistic that SK hynix will return to profit in the fourth quarter. Analysts believe that due to strong sales of high-end memory such as HBM, the turnaround will be faster than expected. However, Park Jung-ho also cautioned against being too optimistic about economic recovery and investment expansion, saying that "the US economy is very likely to deteriorate next year."

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