Shulou(Shulou.com)11/24 Report--

CTOnews.com November 13 news, according to Taiwan Economic Daily, TSMC CoWoS advanced packaging demand burst, in addition to Nvidia has decided to expand orders in October, Apple, AMD, Broadcom, Marvell and other heavyweight customers have also pursued orders substantially recently.

It is said that TSMC has been working to speed up the expansion of CoWoS advanced packaging capacity in response to the needs of the above five major customers, and it is expected that next year's monthly production capacity will increase by about 20% to 35,000 pieces more than the original target.

Industry analysts said that the big chase of TSMC's five major customers shows that AI applications have sprung up everywhere, and the demand of major manufacturers for AI chips has increased significantly.

According to CTOnews.com query, CoWoS advanced packaging technology is mainly divided into three types-CoWos-S, CoWoS-R and CoWoS-L. CoWoS-L is one of the latest technologies, which combines the advantages of CoWoS-S and InFO technology, and uses intermediary layer and LSI (native silicon interconnection) chip to provide a flexible integration scheme, which can be used for chip-to-chip integration.

Public data show that Invid is currently TSMC CoWoS advanced packaging major customers, almost 60% of the related production capacity, including H100, A100 and other AI chips are used, and AMD's latest AI chip products are currently in mass production, it is expected that next year's listing of MI300 chips will adopt SoIC and CoWoS and other two advanced packaging structures.

In addition, Cyrus, a subsidiary of AMD, has always been a major customer of TSMC CoWoS advanced packaging. With the future AI demand continues to increase, Cyrus, Broadcom and other companies also began to add CoWoS advanced packaging capacity to TSMC.

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