Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com November 12, ZDNet revealed that Samsung is actively considering using 3D Chiplet (core particle) technology in its future Exynos series SoC.

"Samsung Electronics is considering applying 3D Chiplet to Exynos internally," a person familiar with the matter explained, adding, "We think there will be significant benefits from this." He pointed out that 3D Chiplet helps to improve the production efficiency of Exynos, thereby enhancing its competitiveness.

Chiplet is mainly a kind of die (bare chip) which meets specific functions. Through die-to-die interconnection technology, multiple module chips and underlying basic chips are packaged together to form a system chip to achieve a new form of IP reuse, which is very different from the mainstream SoC design concept.

At present, the mainstream SoC system-level single chip is mainly to make multiple computing units responsible for different types of computing tasks on the same wafer by lithography. For example, mobile phone AP chips mainly integrate different units such as CPU, GPU, DSP, ISP, NPU, Modem and many interface IP.

Relatively speaking, Chiplet decomposes a complex SoC chip according to different computing units or functional units from the time of design, and then each unit selects the most suitable semiconductor process to manufacture separately, and then connects each unit to each other through advanced packaging technology, and finally integrates and encapsulates into a system-level chipset.

With the evolution of the chip manufacturing process to single digit nanometer (nm), the process difficulty and the complexity of the internal structure are increasing, the manufacturing process is more complex, and the design cost of the whole chip process is greatly increased, which is also one of the major reasons why Chiplet has attracted much attention.

Coupled with the slowing down of Moore's Law in recent years, under this background, Chiplet is highly expected by the industry, or will continue the "economic benefits" of Moore's Law from another dimension.

At present, representative companies such as NVIDIA, AMD and Intel are bringing Chiplet into the development of HPC system semiconductors. CTOnews.com noted that TenStorent, a Canadian AI semiconductor start-up, recently announced that it would use Samsung to produce 4nm chips.

Foreign media also pointed out that Mobile AP is the field that needs cutting-edge foundry technology most, and it is very sensitive to yield. Therefore, more stable production can be achieved by using 3D Chiplet.

In addition, based on the 3D packaging technology, we can further reduce the overall package size of the chip, and improve the bandwidth and efficiency at the same time by increasing the connectivity between the chips.

In the second quarter of this year, Qualcomm accounted for 40% of mobile AP's market share by sales, Apple 33%, MediaTek 16% and Samsung Electronics only 7%, according to market research firm Counterpoint Research.

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