Shulou(Shulou.com)11/24 Report--

CTOnews.com, November 4 (Xinhua)-- Chinese scientists have recently successfully developed a passive heat dissipation system using salt water, which can increase the running speed of the processor by 32.65%. This passive heat dissipation system not only has obvious heat dissipation effect, but also has a very low production cost.

The full name of the system is hygroscopic salt film encapsulated radiator (HSMHS), which is a kind of hygroscopic radiator with salt filling film. The radiator uses a standard heat dissipation device and is covered with a porous membrane material filled with lithium bromide salt water solution.

Electronic components are cooled by desorption of salt solution-water vapor evaporates through a porous film to remove heat from the cooling element and replenish the water supply by absorbing water directly from the air during heat dissipation.

The system was jointly developed by scientists from the City University of Hong Kong and the School of Energy of Huazhong University of Science and Technology, and the related results have been included in Sciencedirect.

The HSMHS radiator can keep the processor temperature below 64 degrees Celsius for 400 minutes, more than 6.5 hours, during which time the cooling system replenishes its cooling capacity by absorbing moisture from the air. The inventors also tested the HSHS system, which has no film, so it is inefficient.

HSMHS has economic advantages: libr-based systems are a thousand times cheaper than chromium-based metal-organic frames, and chromium is also considered promising in passive cooling of electronic devices. Chinese scientists have suggested that their invention could be used not only to cool processors, but also to cool solar panels, batteries and entire buildings.

CTOnews.com attached here the address of the paper: Zengguang Sui, Yunren Sui, Zhixiong Ding, Haosheng Lin, Fuxiang Li, Ronggui Yang, Wei Wu,Membrane-encapsulated, moisture-desorptive passive cooling for high-performance, ultra-low-cost, and long-duration electronics thermal management,Device,2023,100121,ISSN 2666-9986, https://doi.org/10.1016/j.device.2023.100121..

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