Shulou(Shulou.com)11/24 Report--

Socionext Inc. ("Socionext"), a leader in SoC design and application technology, announced that it has begun to develop ADAS and self-driving customized SoC (System-on-Chip) based on TSMC's latest 3nm vehicle specification process "N3A". The product is expected to begin mass production in 2026.

At present, the TSMC 3nm process has been officially mass-produced. Compared with the previous process, the 3nm process has a significant improvement in power consumption, performance, and area (PPA). Compared with the previous generation 5nm N5 process, the current 3nm N3E process can improve the performance by 18% at the same power, reduce power consumption by 32% at the same performance, and increase the transistor density by about 60%. In terms of on-board applications, the high computing power required by the new generation of ADAS and self-driving conflicts with the improvement of battery life and driving distance, but the PPA optimization of 3nm process plays an important role in the future SoC development of electric vehicles (EV).

Socionext has rich experience in ISO26262 "road vehicle functional safety" certification, AEC-Q100 vehicle specification certification and IATF-16949 quality management system support, combined with TSMC N3A process technology, can meet the needs of automotive companies to accelerate the development of automotive electronic systems.

Hirohito Yoshida, Executive Vice President and head of Global Development of Socionext, said, "We are pleased to continue to use TSMC's cutting-edge technology in the development of SoC for vehicles. ADAS and autopilot technology continue to evolve, and our customers invest in customized SoC solutions to differentiate products and optimize hardware computing and software platforms. Socionext has rich experience in on-board chip design, which can meet customers' requirements for multi-core CPU, AI acceleration, image and video processing, high-speed interface integration, safety and functional safety support, and help customers build a new generation of automotive platform. TSMC is an important wafer manufacturing partner of Socionext, and its products can be used in a variety of applications such as automotive, consumer electronics, data centers and networks. "

Dr. Cliff Hou, Senior Vice President of TSMC Europe and Asia sales, pointed out: "Socionext is one of the first partners to adopt TSMC's advanced vehicle application technology. TSMC's comprehensive on-board technology platform can help Socionext quickly use 3nm technology to achieve ADAS and self-driving computing requirements without affecting safety and reliability. at the same time, we hope that TSMC technology will bring more creativity to social life."

Socionext plans to cooperate closely with TSMC on the cooperation project, starting from the early release of N3A process N3AE, speeding up the mass production of vehicle specification-level products, and aiming to become one of the first suppliers of vehicle specification-level products to adopt N3A process.

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