Shulou(Shulou.com)11/24 Report--

CTOnews.com October 28 news, David McAfee, vice president of AMD, recently in an interview with South Korean media, explained why the company does not use chiplets in mobile APU.

McAfee believes that if the mobile domain transitions to chiplets design, it will inevitably have a negative impact on processor power consumption.

Chiplet, also known as core or small chip, is a kind of die (bare chip) that meets specific functions. Through die-to-die internal interconnection technology, multiple module chips and underlying basic chips are encapsulated together to form a system chip to achieve a new form of IP reuse.

Processor TDP for ultrabooks and slim books is usually between 15 and 30W. AMD currently relies entirely on monolithic bare chip design (monolithic die design) and will not change in the short term.

When asked why AMD's successful chiplet design in desktop processors was not extended to mobile, CTOnews.com translated McAfee's answer as follows:

When developing new desktop and mobile products, we will consider the monolithic and chiplet architecture.

However, in the transition to chiplet architecture, notebooks are bound to face huge challenges in terms of energy efficiency. If the mobile chip adopts chiplet architecture, it is bound to make a compromise in terms of power consumption.

Taking all factors into account, we now see that the monolithic structure of the processor is more energy-efficient than the small chip structure. If this changes in the future, we may consider using chiplet in the mobile space.

It should be added that McAfee's answer is limited to AMD's mobile processor (APU). In the AMD Ryzen 7000 series of mobile processors, some Dragon Range processors adopt chiplet architecture. They are essentially desktop Ryzen 7000 chips, but they are packaged by mobile BGA.

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