Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens who are very homesick and afraid of the delivery of clues! CTOnews.com, October 25, Qualcomm today released Snapdragon 8 Gen 3 and X Elite processors, as well as new S7 and S7 Pro-Gen 1 audio chips for headphones, speakers and mobile computing platforms.

The new audio platform has high performance, low power consumption, artificial intelligence on the device and advanced connection functions. the computing power of this platform is six times that of the previous generation platform, and the artificial intelligence power is almost 100 times that of the previous generation platform. and achieve new ultra-high-end performance with low power consumption.

The S7 Pro sound platform was the first to support Qualcomm's extended personal area Network (XPAN) technology and Micropower Wi-Fi connections, providing a superior audio range than Bluetooth.

S7 and S7 pro also have device-side artificial intelligence for better audio personalization. It also supports lossless music up to 192kHz and enhanced game multichannel space audio, as well as Qualcomm Seamless for better cross-device connectivity. CTOnews.com attached the relevant explanatory documents as follows:

Dino Bekis, vice president of Qualcomm, said:

These platforms set a new benchmark for ultra-low power consumption and high performance sound. They are equipped with advanced technology to work with artificial intelligence on the device, no matter where you are, whether you are in meetings, socializing, gaming, listening to music or just need some quiet time. Can provide an immersive personalized audio experience.

The S7 Pro platform uses our micro-power Wi-Fi and revolutionary Qualcomm ®XPAN technology to enable entire home and building audio coverage, support for multi-channel lossless music streaming up to 192kHz, and enhanced game multi-channel space audio.

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