Shulou(Shulou.com)11/24 Report--

CTOnews.com, October 20 (Xinhua) YouTube channel PBKreviews recently dismantled the Samsung Galaxy S23 FE phone, saying that Samsung has equipped the phone with a powerful heat dissipation system, so that the Exynos 2200 chip can have a better performance.

Bank of China Galaxy S23 FE phone (equipped with Snapdragon 8 Gen 1 processor) has been announced its price, starting from 4399 yuan for the first launch, 4399 yuan for 8GB+128GB version and 4899 yuan for 8GB+256GB version on October 27.

CTOnews.com previously reported that Exynos 2200 on the Galaxy S23 FE does seem to outperform the Galaxy S22 series, with a single-core score of 1612 and a multi-core score of 4005 on Geekbench 6.2. In the running score of an Rabbit, the CPU score of Galaxy S23 FE was 329165 and the CPU score of Galaxy S22 Ultra was 305069. In terms of running score, the performance of CPU improved by nearly 10%, but the performance of GPU improved by 30%.

Through disassembly, it is found that Samsung has equipped the Galaxy S23 FE with a very large heat dissipation plate, which can dissipate heat more effectively.

Samsung Galaxy S23 FE is IP68 waterproof and dustproof. After heating the glass backplane, you can see that all openings are sealed with rubber and glue.

The motherboard on the back of the phone is fixed with 20 Phillips screws. After disconnecting the ribbon connector, charging coil and NFC antenna, you can use the pull piece to easily remove the battery. Finally, the VJ scores 8.5 points for the maintainability of the machine.

JD.com Samsung Galaxy S23 FE dual optical anti-shake 4500mAh large battery 5G mobile phone 8GB+256GB Qingyunbai 4899 yuan direct link

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