Shulou(Shulou.com)11/24 Report--

CTOnews.com, October 17 (Xinhua)-- Intel announced in early 2022 that it was working with Submer to develop a new generation of heat dissipation solution, and now launched a device called "forced convection radiator", which aims to support chips with TDP of 1000W and above.

The two companies did not disclose how this heat dissipation solution works, saying only that the solution is reliable, cost-effective and adaptable to different needs. CTOnews.com notes that they also say that some of these parts can be made using 3D printing.

To demonstrate the device's potential, Intel used it to demonstrate the heat dissipation of an undisclosed Xeon processor with a TDP of more than 800W. The two companies claim that the cooling scheme is also competitive with liquid cooling.

Daniel Pope, co-founder and CEO of Submer, said: "many people question the feasibility of single-phase immersion heat dissipation technology, and the forced convection radiator clearly proves that immersion technology can compete head-on with other liquid cooling technologies."

According to Intel and Submer, this heat dissipation file combines the advantages of forced convection with passive heat dissipation mechanisms and seamlessly integrates into existing servers and immersion chassis, ensuring operational continuity and stronger thermal management performance in high-performance computing environments.

Intel Academician Mohan J Kumar said: "the use of submerged radiators with forced convection is a key innovation that can break through current barriers and make single-phase submerged heat dissipation not only as a solution for today, but also as a solution for the future."

This "forced convection radiator" is scheduled to be officially unveiled at the OCP global summit, where Intel is expected to demonstrate its effectiveness and practicality.

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