Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com, October 15 (Xinhua)-- Fujitsu is developing a next-generation processor for artificial intelligence, high-performance computing (HPC) and data center applications-- Monaka, which is currently launched in fiscal year 2027. (CTOnews.com Note: April 1, 2026 to March 31, 2027).

One of the first 2nm data center CPU, Monaka will use about 150 enhanced Armv9 cores and support accelerators, with SVE2 instruction sets, vector lengths that can vary from 128bit to 2048bit, SRAM chips and I / O chips, and will support DDR5 memory, PCIe 6.0connections and CXL 3.0interconnects.

It is worth mentioning that the successor to "Fuyue" is planned to be launched around 2030. Therefore, the main purpose of Monaka is to compete for the emerging data center market, not to solve supercomputer performance problems.

Tuyuan Pexels introduced its next-generation data center processor MONAKA to the media and analysts at a research strategy briefing at the Kawasaki plant on Wednesday.

The processor, which the company plans to launch in fiscal year 2027, will use Arm architecture and TSMC's 2nm process and will be twice as energy efficient as its competitors.

Naoki Shinjo, general manager of Fujitsu's advanced technology development department, said: "the amount of data processed worldwide is expected to reach 10 times that of 2020 in 2030, and explosive growth is expected to continue thereafter." He believes that data will "increase as the amount of data increases, so will the demand for large data centers, but unless we reduce energy consumption, it will be difficult to achieve carbon neutrality."

FUJITSU-MONAKA aims to significantly improve the energy efficiency of data centers and pursue the high-speed data processing required by AI and DX.

According to reports, the processor is based on Fujitsu's unique technology, such as the micro-architecture and low-voltage technology nurtured by supercomputers K and Fugaku, and also uses Arm's latest architecture "Armv9-A" and TSMC's 2nm process, and will also use 3D Chiplet packaging technology.

Fujitsu said it is currently developing about 150 processor cores that support SVE2 SIMD, DDR5 memory, PCI Express 6.0 (CXL 3.0) external interfaces and air-cooled cooling systems.

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