Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen Alejandro86 for the clue delivery! CTOnews.com October 13 news, according to Hebi Daily, October 12 afternoon, Loongxin Zhongke chip packaging base project commissioning ceremony was held in Hebike Innovation City. Loongson Zhongke chip packaging base is located in Hebike Innovation City ParknShop Intelligent Industrial Park, which is the first chip packaging project of Godson Zhongke in the country.

The first phase of the project officially started in April this year, with the completion of a 1000-class clean workshop of 402 square meters, a 10,000-class clean workshop of 226 square meters, and a constant temperature and humidity warehouse of 92 square meters.

According to the person in charge of Godson Zhongke Technology Co., Ltd., the project has initially possessed the packaging, testing, packaging and shipping capabilities of bonding and packaging Godson-1 chips, and accelerated the construction of Godson-1 series chips. and the packaging and testing capability of power / clock chips. The next step will gradually accumulate experience, reserve talents, and strive to build a nationally produced chip packaging system.

According to the official website of Godson, Godson No. 1 is a product developed by Godson for embedded special applications by CTOnews.com. At present, the official website lists three products:

Godson 1C101: Godson 1C101 is a single chip chip optimized for door lock application on the basis of Godson 1C100.

Godson 1C102: a customized chip product in the embedded field, mainly for smart homes and other Internet of things devices

Godson 1C103: for motor drive IOT products, with Godson LA132 processor as the computing core, is a microcontroller chip designed for motor drive applications.

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