Shulou(Shulou.com)11/24 Report--

CTOnews.com October 12 news, in the wave of artificial intelligence, the market demand continues to surge, HBM technology has become the focus of attention. Global market research firm Jibang Consulting expects HBM demand to grow 58 per cent year-on-year in 2023 and is likely to grow by about 30 per cent in 2024.

HBM, whose full name is High Bandwidth Memory, is a new type of CPU / GPU memory chip. Many DDR chips are stacked together and encapsulated with GPU to achieve a high-capacity, high-bit-width DDR array.

Compared with traditional DRAM, HBM has the advantages of high bandwidth, high capacity, low latency and low power consumption, so it is especially suitable for high-performance computing scenarios such as ChatGPT.

CTOnews.com Note: since the launch of the first HBM product with TSV packaging technology in 2014, HBM technology has undergone several upgrades, including HBM, HBM2, HBM2E, HBM3, and HBM3e.

At present, the two companies at the forefront of HBM3 research and development are SK Hynix and Samsung. Nvidia's H100 / H800 and AMD's MI300 series AI accelerator cards all use HBM3.

SK Hynix and Samsung are expected to provide HBM3e samples in the first quarter of 2024. On the other hand, Micron, an American memory company, is bypassing HBM3 and pursuing HBM3e directly.

The HBM3e will use a 24Gb single crystal stack and an eight-layer (8Hi) configuration, and the capacity of a single HBM3e chip will soar to 24GB.

HBM3e is expected to include NVIDIA's GB100 in 2025, leading to plans for the three major OEM to release HBM3e samples in the first quarter of 2024 and enter mass production in the second half of the year.

In addition to HBM3 and HBM3e, the latest updates indicate that the storage giant is planning to launch the next generation of HBM--HBM4.

Samsung recently announced that it has developed 9.8Gbps HBM3E and plans to provide samples to customers. In addition, Samsung is actively developing the HBM4 with the goal of starting supply in 2025.

Samsung Electronics is reportedly developing non-conductive adhesive film (NCF) assembly and hybrid bonding (HCB) to optimize high-temperature thermal properties for HBM4 products.

Although HBM4 is expected to make a major breakthrough, there is still a long way to go, so it is too early to discuss its practical application and widespread adoption. Industry experts stressed that the current HBM market is dominated by HBM2e. However, HBM3 and HBM3e are expected to take the lead in the near future.

Ji Bang Consulting expects mainstream demand to shift from HBM2e to HBM3 in 2023, accounting for about 50 per cent and 39 per cent respectively. As more HBM3-based accelerator chips enter the market, demand will shift sharply to HBM3 in 2024, surpassing HBM2e and is expected to account for 60 per cent of the market.

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