Shulou(Shulou.com)11/24 Report--

CTOnews.com October 9 news, Samsung in this year's Galaxy S23 series using a larger heat dissipation solution, and according to the X platform whistleblower RGcloudS, Samsung is testing a technology called "combined coil antenna", which is said to be able to integrate antenna, wireless charging, NFC and other technologies in the heat sink wrapping the fuselage, thus ensuring large area heat dissipation while improving the signal strength of the phone.

▲ image source RGcloudS posts released on X platform

▲ RGcloudS uses RGcloudS, a demonstration of heat dissipation technology produced by Huawei Mate 40, to say that at present, the copper sheet used in mobile phones will affect the signal of mobile phones, so the coverage of heat sink on the back panel of mobile phones on the market is not more than 90%.

The combined cooling copper sheet developed by Samsung will be made of flexible printed circuit board (FPCB), which supports integrated wireless charging and NFC, as well as UWB chip, Bluetooth and other functions, which can ensure signal strength while taking into account the heat dissipation capacity.

However, CTOnews.com found that RGcloudS also claimed that mobile phones with this scheme cannot use fast wireless charging of more than 80W, and the temperature generated by wireless charging is 50% higher than that of wired charging. At this temperature, the problem of wireless charging of mobile phones can easily reduce the life of communication chips such as NFC integrated in the heat dissipation copper sheet.

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