Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen Alejandro86 for the clue delivery! CTOnews.com October 9 news, according to South Korean media ChosunBiz reported, industry insiders analyzed on the 4th of this month, Samsung Electronics, TSMC 3nm process quality rate is currently about 50%.

According to the report, it was reported that Samsung Electronics had a good 3nm rate of more than 60% and had delivered a chip to Chinese customers, but because the process omitted the SRAM in the logic chip, it was difficult to regard it as a "complete 3nm chip."

According to the industry, although Samsung has taken the lead in mass production of the key 3nm full grid technology (GAA), its output is not enough to affect big customers. In this technology, because the gate surrounds the four sides of the current channel in the transistor that makes up the semiconductor, it is naturally more difficult than the previous process of circling the three sides. "to win orders for 3nm mobile chips from big customers such as Qualcomm next year, the yield needs to increase to at least 70 per cent," said a person familiar with Samsung.

As for TSMC, although it is currently the only company with a record of mass production of 3nm, its output is also lower than originally expected. Some analysts said that TSMC's 3nm process uses the same FinFET structure as the previous generation process and may not be able to control the overheating problem.

At present, the two companies are still trying to achieve the goal of more than 60% of the quality products. TSMC plans to mass produce N3E, N3P, N3X, N3AE and so on next year, with the focus on improving the rate of quality products and reducing costs.

In addition, a semiconductor industry source revealed that Samsung, TSMC and Intel are all preparing 2nm processes, but compared with 3nm, the improvement in performance and power efficiency is "not obvious", so it is expected that the demand for 3nm process chips will last longer than expected.

CTOnews.com previously reported that Tianfeng International analyst Guo Mingyi posted on the X platform (formerly Twitter) late last month to interpret the current overheating of Apple's iPhone 15 Pro phones and said it had "nothing to do with TSMC's 3nm production process."

Guo Mingyi said: "my investigation pointed out that the overheating problem of the iPhone 15 Pro series has nothing to do with TSMC's 3nm process, and it is likely that it is mainly to make the weight lighter, so a compromise has been made to the design of the heat dissipation system, such as the small heat dissipation area and the use of titanium alloy to affect the heat dissipation effect. Apple is expected to fix the problem by updating the system, but the improvement may be limited unless processor performance is reduced. If Apple does not properly address this problem, it may not be conducive to shipments of the iPhone 15 Pro product cycle. "

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