Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com, October 2 (Xinhua)-- TSMC announced the next generation of new 3Dblox version 2.0 open standards on OIP 2023 (Open Innovation platform ecosystem Forum), according to a report by Taiwan media "Industrial and Commercial Times". Lu Lizhong, deputy general manager of TSMC's design and technology platform, said that TSMC assists in industrial integration through alliances to help customers accelerate into the new generation of AI.

Reported that among the two major AI chip manufacturers, AMD's MI300 series has begun to introduce 3Dblox packaging architecture, and Nvidia's next generation GPU B100 is expected to be introduced in the second half of next year.

IC designers said that semiconductors are moving towards heterogeneous integration and small chip (CTOnews.com note: core) architecture, and TSMC's establishment of standards will simplify chip design and help enhance the competitiveness of the industry.

Practitioners pointed out that the development of chips used to be on the track of Moore's Law, and the key to the breakthrough of the process lies in the miniature technology at the 2D level, but with the advent of the physical limit, semiconductor efficiency has entered a new stage of development in 3D stacking in order to make a breakthrough. After the 2.5D packaging process CoWoS is favored by Nvidia and the production capacity is in short supply, TSMC is actively establishing an open standard for the next generation of packaging 3Dblox, which is expected to shorten the customer's development process from architecture to taping.

Liu Deyin, chairman of TSMC, highlighted the 3D Blox standard a few days ago. TSMC launched the 3Dblox open standard last year, which aims to simplify and modularize 3D IC design solutions for the semiconductor industry.

Dr. Yu Zhenhua, deputy general manager of TSMC, revealed that TSMC develops various 3D IC technologies in order to make the distance between circuits closer and closer. "there is even a possibility that two different chips will grow together in the future." According to his analysis, the efficiency of the semiconductor industry has tripled in the past 15 years, and the trend will continue, which is equivalent to proposing to the global semiconductor industry a TSMC curve that will triple the chip efficiency in 15 years.

Welcome to subscribe "Shulou Technology Information " to get latest news, interesting things and hot topics in the IT industry, and controls the hottest and latest Internet news, technology news and IT industry trends.