Shulou(Shulou.com)11/24 Report--

Abstract: science and technology create core, ecological win-win, accelerate SoC product iteration, strengthen IP reuse and division of labor, and jointly build upstream and downstream ecology.

The global industry is leaping from information to intelligence, and the semiconductor industry is ushering in a new round of demand. Innovations in intelligent devices, the Internet of things, artificial intelligence, automation systems, and multiple application scenarios such as 5G communications, edge computing and quantum computing continue to stimulate the potential of the domestic market and promote SoC chips such as computing power and car rules to change from "building potential" to "breaking potential".

The 2023 Beijing Microelectronics International Symposium and IC WORLD Conference was solemnly held from September 25 to 27, sponsored by Beijing Bureau of economy and Information Technology, Beijing Economic and technological Development Zone Management Committee, Beijing Semiconductor Industry Association, Zhongguancun Core chain Integrated Circuit Manufacturing Industry Alliance, SEMI China and Beijing Integrated Circuit Society, including 1 summit forum and 12 special sub-forums. Hundreds of experts, scholars and business leaders from the world's top universities, research institutions and integrated circuit industry chain enterprises, focusing on the development trend and cutting-edge technology of the integrated circuit industry in 2023, launched an authoritative, professional and forward-looking high-level academic exchange, attracting 200 + integrated circuit upstream and downstream enterprises to comprehensively display the latest achievements and applications, and 8000 + academic and industrial audience offline to participate in the conference. Gather wisdom and strength for a new round of innovation and development of China's integrated circuit industry.

▲ IC World conference site

Professional cutting-edge technology sharing, enabling "science and technology to create the core, ecological win-win"

As the ecological entrance of IC design and mass production, IP determines chip integration and product energy efficiency, safety and reliability. It is more and more urgent to accelerate independent innovation, accelerate SoC product iteration, strengthen IP reuse and division of labor, and jointly build upstream and downstream ecology. In this context, the Beijing Integrated Circuit Society has set up an IP and IC Design Service Forum, which is specially hosted by Core Technology, and the enabling industry chain "Science and Technology to create Core, Ecological win-win". Director Li Yantao, director of the special class of integrated circuit industry in Beijing Economic and technological Development Zone, and Chen Xiaonan, secretary general of Beijing Integrated Circuit Society, attended and delivered a speech. A number of leading companies in the field of IP and IC share a variety of cutting-edge technological achievements for computing chips, regulation-level chips and AI chips from car to end to cloud, which have been well received by hundreds of experts, scholars and colleagues in the industry, and the response is enthusiastic.

Chen Xiaonan, secretary general of the Beijing Integrated Circuit Society, delivered a speech and looked ahead. He said that the integrated circuit industry is a strategic, basic and leading industry, and IP and IC design is an important part of industrial innovation, which requires a high degree of consensus and strength from all walks of life of industry, university and research, so as to introduce resources, contribute wisdom and cultivate ecology for domestic technology and products, and win-win results hand in hand.

Speech by Chen Xiaonan, Secretary-General of ▲ Beijing Integrated Circuit Society

01 core dynamic technology: domestic computing chip IP "three-piece set" HBM/ DDRn, Chiplet, SerDes

College of Deputy General Manager of Core Science and Technology Engineering

With the global industrial informatization leapfrogging to intelligence, the semiconductor industry ushered in the outbreak of demand for SoC chips such as computing power. As the cornerstone of SoC chips, IP determines chip integration and product energy efficiency, safety and reliability, especially Chiplet and other computing chips IP become the key to chip performance breakthrough. To meet the urgent needs of domestic upstream and downstream enterprises and chip products, core has launched a domestic computing chip IP "three-piece set", including high-end HBM / DDRn series (HBM3/2e,LPDDR5X/5,GDDR6X/6,DDR5/4), Innolink ™Chiplet series compatible with UCIe standards, and SerDes (PCIe6/5) series, providing one-stop turnkey integration of PHY and Controller, PPA scene optimization, and covers the global major foundry 55nm to 3nm mainstream process. In particular, 12/10/8/7/6/5/3nm and other advanced FinFET processes have been verified, have a rich record of mass production, and have authorized billions of high-end SoC chips around the world to ensure production safety across platforms.

02 Sierxin: optimization and adjustment of architecture design to meet technical barriers and challenges

Liang Jianzhong, vice president of Sierxin

With the advent of the 5G era, emerging technologies such as the Internet of things, artificial intelligence, data centers, cloud computing, machine learning, autopilot and other emerging technologies have been widely developed, giving birth to a large number of chip IP core applications. In the complete product design, not only the expansion ability of each part should be tested, but also the coordination among the parts is more important, which is the core element to ensure the high performance of the product and shorten the design cycle. In order to meet this challenge, Silcore launched the core craftsman software. The software builds architecture simulation based on the concept of IP module, and models, optimizes and adjusts the design from many angles to deal with various technical barriers and design challenges. This not only improves the comprehensiveness of design verification, but also accelerates the launch cycle of the product.

03 Core Technology: the trend of IP / SOC Integration and customized Development of Automotive Electronic chips

Luo Tong, Deputy General Manager of Integrated Circuit of Core Technology

In the era of AI and autopilot, SoC design requires more advanced process nodes and packaging technology, higher integration and complexity, as well as higher performance IP and high-speed interface communication technology, which requires a cross-disciplinary, cross-disciplinary, cross-process, all-round experience IP + design service common platform. Core Technology provides the most comprehensive interface IP in the industry, which has been verified by the production lines of major wafer factories, and is far ahead in terms of bandwidth, speed, stability, reliability, etc., which can greatly enhance the system capacity and fully meet the high data transmission and processing needs of in-vehicle entertainment control and communication interactive automotive chips. At the same time, it provides architecture, bus / core splicing, IP integration / SoC integration, and a full set of customized mass production services such as autopilot / intelligent cockpit / entertainment central control SoC, MCU / ISP, such as architecture design, multi-platform coverage driver verification, back-end and process optimization, Chiplet large chip integration, system-level design optimization, supply chain integration, etc. Help partners to quickly launch highly competitive products in the market, enabling the domestic automotive semiconductor industry chain.

04 China Science and Technology Corporation: self-controllable PSoC chips for high-performance and low-cost industrial upgrading

Cai Gang, executive vice president and chief engineer of China Science and Technology Yihaiwei

Under the challenge of prominent computing bottleneck and more difficult chip integration, PSoC has become an effective solution to enhance the competitiveness of products. It can flexibly integrate a variety of heterogeneous IP cores (including core IP, such as eFPGA, XPU, DSP, ADC, high-speed interface, etc.), and has the advantages of high performance, low power consumption and flexible programming. The performance of the system is improved by heterogeneous fusion, and the "software definition chip" is realized by hardware programming, which provides an effective solution for board-level systems to achieve high-performance and low-cost upgrade.

05 Zhixin Company: "core" demand and "core" technology under the new power system

Gan Jie, Deputy Manager of Digital Chip Design Center of Zhixin Company

With the establishment of dual-carbon goal in China, the new power system, as the core, has put forward higher requirements for digital technology and chips. all kinds of equipment in various subdivided fields in power system, such as communication and security, sensing and measurement, control and protection, are faced with digital, intelligent and compact requirements, which all need basic chip support. Focusing on the needs of power business, Zhixin has created eight kinds of chip product lines with core competitiveness, such as security chips, main control chips, communication chips, sensor chips, artificial intelligence chips and so on.

06 episode Chuangbei: the development and evolution of intelligent cockpit display chip

Deng Ziqiang, Marketing Director of Jichuang North Automotive products

Under the background of the rise of the new energy vehicle market, intelligent driving and intelligent cockpit upgrading, the automobile market demand continues to maintain a high growth, due to the enhancement of the computing power of the cockpit chip and the increase of human-computer interaction. Automobile intelligent cockpit display is becoming more and more diversified and large screen. In this regard, Jichuang Northern layout and developed the vehicle TDDI chip, vehicle Bridge chip, MiniLED driver chip and vehicle power management chip and so on.

07 clear micro intelligence: the key point of reconfigurable intelligent vision chip

Hu Yunfei, R & D Director of Qingwei Intelligent Vision Product Line

Reconfigurable computing, the core technology of Qingwei intelligent AI chip, stems from the accumulation of Tsinghua reconfigurable computing research team over the past decade. Products and solutions cover a wide range of industries, including smart government, smart health care, smart education, smart energy, smart manufacturing, smart finance, intelligent transportation and so on. This new chip architecture technology has the advantages of both general chip flexibility and high efficiency of application-specific integrated circuits, and can flexibly configure hardware resources according to different algorithms and application requirements. Reconfigurable chips have the characteristics of low delay, high efficiency, high flexibility and software self-adaptation, resulting in higher effective computing power and lower power consumption.

At the event site, participants and speakers conducted in-depth exchanges and discussions on hot topics such as IP ecological co-construction and SoC product innovation, focusing on hot spots in the industrial chain, pulsing the market and technological frontiers, and reaching a consensus on strengthening ecological cooperation and win-win innovation among domestic semiconductor upstream and downstream enterprises. Many industry colleagues said, "I hope that there will be more opportunities for such exchanges and sharing between upstream and downstream partners to draw on collective wisdom." Explore a new path for the development of the chip market and promote co-construction, co-prosperity and sharing.

The core of the Expo is gathered to link the development of the industrial chain.

▲ IC World Expo site

In order to promote collaborative innovation and industrial cooperation, and adhere to open innovation and win-win cooperation, this IC World Expo has created three major exhibition areas: industrial chain achievements exhibition area, enterprise special area and industry-university-research area, covering an exhibition area of nearly 10,000 square meters, covering more than 130 units of industrial chain enterprises, universities and industry organizations to fully display the current development achievements of the integrated circuit industry chain. Promote coordination and cooperation of the integrated circuit industry chain for mutual benefit and win-win results.

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