Shulou(Shulou.com)11/24 Report--

CTOnews.com September 28 news, SK Hynix HBM3E memory ushered in a new competitor-Meguiar. Micron said that the new HBM3E can also reach a speed of 1.2 TB / s, and has delivered samples to customers such as Nvidia, and expects orders to be booked next year.

Meguiar's HBM3E memory uses eight-tier layout, each stack is 24 GB, using 1 β technology production, with excellent performance.

Micron says its HBM3E will cost less than its competitors in addition to providing the same level of performance as its competitors. Micron said it would start commercial shipments next year and is seeking certification of these products to meet Nvidia's requirements.

CTOnews.com Note: HBM (High Bandwidth Memory) refers to the vertical connection of multiple DRAM, which can significantly improve the speed of data processing. HBM DRAM products are developed in the order of HBM (first generation), HBM2 (second generation), HBM2E (third generation), HBM3 (fourth generation) and HBM3E (fifth generation). HBM3E is an extended (Extended) version of HBM3.

Related readings:

"SK Hynix has developed the world's highest HBM3E memory: up to 1.15TB / s, for use in the AI industry."

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