Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com Sept. 27, Samsung Electronics announced yesterday that it has developed its first 7.5Gbps (CTOnews.com Note: 0.9375GB/s) low-power Compression additional memory Module (LPCAMM) form specification, which combines the advantages of small size and detachability and will be commercialized in 2024.

After the news was released, foreign media anandtech got more detailed information about the memory of the LPCAMM. The key contents of CTOnews.com translation are as follows:

LPCAMM memory is an improvement made by Samsung to use the CAMM specification interface for LPDDR memory, but the LPCAMM form factor is not compatible with CAMM (both physically and electrically), so although the two names are similar, they are not interchangeable.

The ▲ drawing source anandtech is via LPCAMM, and Samsung places the 4x32 LPDDR5X memory particle package directly on the compression connector (compression connector), allowing the use of a 128bit memory bus on a single memory module.

As can be seen from a pad chart provided by Samsung, the contact of the LPCAMM memory is located on the back of the PCB board, corresponding to the location of the four LPDDR5X memory particles. In other words, the memory particles and contacts are very close, which can minimize the distance of signal transmission between the memory controller and the memory chip.

The ▲ drawing source anandtechLPCAMM memory size is 78mm x 23mm. In addition to the DRAM package itself, SPD and power management IC (PMIC) are included under the LPCAMM module. Like the CAMM standard, this standard allows modules to provide their own voltage regulation and identification.

For the first generation of LPCAMM memory, Samsung wants to offer versions of 32GB, 64GB and 128GB with data rates up to LPDDR5X-7500. However, Samsung currently does not have 256Gbit LPDDR5X memory particles, so to achieve a single 128GB, either install eight particles on the LPCAMM, or increase the memory size as a whole.

Samsung said LPCAMM could reduce the share of motherboard by up to 60 per cent compared with So-DIMM. This not only makes more efficient use of the internal space of the device, but also improves performance and energy efficiency by 50% and 70%, respectively.

This research and development achievement has been verified on the Intel platform. Samsung will work with major customers, including Intel, to test LPCAMM on next-generation systems this year, and plans to commercialize it in 2024.

As for standardization, according to Samsung, it is working with partners to develop LPCAMM's JEDEC standard. Meanwhile, JEDEC announced in March that it is committed to extending the CAMM standard to cover LPDDR memory and to use the same connectors for DDR5 and LPDDR5, but no further information has been released yet.

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