Shulou(Shulou.com)11/24 Report--

Thank CTOnews.com netizens soft media Xinyou 1933769 for the clue delivery! CTOnews.com September 24 news, South Korea's gamma0burst released a Qualcomm internal information, although most of the key information is coded, but we can still see some intention about Qualcomm's future OEM cooperation.

What everyone is most concerned about is that Qualcomm is investigating Samsung's SF2P process, but the next product (Snapdragon 8 Gen 4) is confirmed to be based on TSMC's N3E process.

In addition, Qualcomm Snapdragon 8 Gen 3 has a 3nm version in addition to TSMC's 4nm version, and its Cortex-X4 and Cortex-A720 will be built by 4nm / 3nm process. The details are unknown, which may be preparing for an improved version such as "SM8475".

At present, TSMC N3E is close to mass production, and N3P is now in the stage of IP development, so it is difficult to expect N3P to be listed in 2025, but this possibility is not ruled out.

To sum up, Qualcomm's deployment of the flagship AP process is as follows: N4P (Snapdragon 8 Gen 3) → N3E (Gen 4) → N3P (Gen 5) → SF2P.

Foreign media estimated that the same period Exynos process: SF4P (2024) → SF3P (2025) → SF2? (2026), so Snapdragon SoC will lag behind Exynos in process in 2026.

In other aspects, Samsung 4LPP+ process has been filmed, combined with the previous revelations speculated to be Exynos 2400 (S5E9945).

Judging from these data alone, it is difficult to tell whether the chip is a large-scale update or an update small enough to be called "squeezing toothpaste", but it seems that the high probability is just a general "custom" improvement product.

In terms of duration, the new platform will include Xclipse920, so it is not clear whether the customization refers to Xclipse920 or successor products.

Unsurprisingly, Samsung's goal for 2024 is Exynos 2400, and the next two products seem to have a basic framework in place and are currently under development.

Samsung Semiconductor customers include Tesla, Intel, Google, Sony and so on.

Samsung's Harman midrange SoC project is under way.

In addition, there is some information about Meta, Intel and AMD. Judging from the data, Meta (CTOnews.com Note: formerly known as Facebook) seems to be developing its own AR / VR GPU scheme.

Intel, on the other hand, repeats some of the same old tunes about Panther Lake Xe3 LPG, but also validates some of the previous revelations. In Xe3-based products, HPG seems to be Celestial.

In addition, AMD seems to be considering a multi-Die chip solution for the next generation of Sony PlayStation / Microsoft Xbox game consoles.

There is also about the Nvidia T239 chip rumored to be used in Nintendo's new machine, but the T239 is quite an old platform. While this does not confirm that the next generation of Switch will adopt the platform, it does at least confirm the existence of T239.

RPC and CPC of ▲ Intel Big Core are abbreviations for Raptor Cove and Cypress Cove.

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