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Oriental Jingyuan makes a wonderful debut at the first IDAS Summit to accelerate the layout of the whole process tool chain of EDA Plus

2025-01-16 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >

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On September 18, the first IDAS Intelligent Design Automation Summit was successfully held in Wuhan Optical Valley Science and Technology Exhibition Center. Dongfang Jingyuan, as a special sponsor of this conference, made a wonderful appearance, actively communicated and deeply communicated with upstream and downstream enterprises of the industrial chain through summit forum speeches and booths, showing the latest practice and exploration of the company in calculation lithography and yield management solutions.

At the summit forum, the upper and lower reaches of the industry gathered together, full house, a time of popularity explosion, unprecedented grand occasion. Dr. Yu Zongqiang, Chairman and CTO of the company, gave a speech entitled "Building China EDA Plus Full Process Tool Chain_Chip Manufacturing from Art to Science to Intelligence". Dr. Yu Zongqiang mentioned the challenges and opportunities faced by the post-Moore era and shared his HPOTM (Holistic Process Optimization) yield maximization technical route and product design concept proposed in 2014. At the same time, with the rise and application of large computing power, big data and large models, it is possible to optimize the overall chip design to manufacturing, and it also provides unprecedented opportunities for the practice and evolution of HPOTM. Based on HPOTM yield maximization technology route and product design concept, Dongfang Jingyuan is carrying out EDA Plus technology layout, creating technical advantages of nano-level inspection + seamless link of core tool chain, establishing integrated design and manufacturing solutions driven by chip manufacturing yield, reshaping chip design/manufacturing ecology, and creating GoldenFlow of integrated circuit manufacturing in China.

At the Oriental Jingyuan booth, technicians conducted Demo demonstrations for everyone, attracting a large number of professional spectators. Through multiple Demo jobs of MODEL, OPC and LRC, technicians demonstrated the technical strength and technical advantages of Dongfang Jingyuan in considering accurate optical model of 3D mask and photoresist model modeling, mask optimization and inversion lithography technology, photolithography defect detection and graphic interface operation, and conducted in-depth communication with professional audience on technical details.

Based on inversion lithography technology, Dongfang Jingyuan computational lithography products adopt CPU+GPU hybrid supercomputing architecture and open software architecture, and core functions are accelerated by CUDA technology, which is fundamentally ahead of the technical route adopted by similar products in the market. At present, the product has a complete functional chain, including accurate process simulation, DRC, SBAR, OPC, LRC, DPT and IRO, etc., especially for the first time in the production line based on reverse lithography technology to achieve full-chip mask optimization application, continue to lead the development of related fields in China.

This IDAS conference ended successfully. In the future, Dongfang Jingyuan will continue to deepen its development in the field of manufacturing EDA such as computational lithography, continue to cooperate with the industry, promote and improve the HPOTM system, and make every effort to build a full-process tool chain for China EDA Plus to help replace and surpass China's integrated circuit manufacturing technology!

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