Shulou(Shulou.com)11/24 Report--

CTOnews.com September 20 news, at today's Intel ON Technology Innovation Summit, Intel introduced the latest Foveros packaging technology. Intel said that starting with MeteorLake, it will introduce Foveros technology into client-side products to create excellent notebooks.

According to reports, most Intel client products, including the 13th generation Intel Core processor, integrate a variety of functions (such as CPU, GPU, PCH) into a single chip called SoC, but as these functions become more diversified and more complex, it becomes more and more difficult and expensive to design and manufacture these monolithic system-level chips.

Intel Foveros advanced packaging technology solves this challenge in one fell swoop. Using high-density, high-bandwidth, low-power interconnection, many modules manufactured by a variety of processes can be combined into a chip complex composed of large-scale separate module architecture.

With the launch of MeteorLake, Intel will introduce a three-module chip, including a graphics module that provides large capacitors, a SoC module that uses Foveros 36x pitch interconnection between chips, and a computing module built using Intel 4 process technology, in which the IO power supply and inter-chip routing of the computing chip are made of metal layers.

Intel assembles high-quality Meteor Lake through a five-step process:

Cutting: receive wafers from internal and external foundry from the fab and cut them into a single chip.

Sorting and Diet testing: single wafer testing ensures that only high-quality wafers can enter the Foveros assembly phase. This detection capability is the key to heterogeneous design, which can improve the test yield by providing more high-quality chips to the assembly line.

Wafer assembly: each module is assembled on the substrate wafer. For the first time in Intel, the production line integrates assembly operations such as chip attachment, bottom filling and wafer molds, as well as manufacturing operations such as collision, grinding and polishing.

Package assembly: the Meteor Lake Foveros complex is assembled on the surface of the BGA substrate. This composite is compatible with existing packaging and assembly tools and processes and requires only a little optimization.

Testing and completion: finally, Intel HDMx and system testing ensure quality, including stress and aging testing, class testing, and system-level platform testing.

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