Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens Wu Yanzu in South China, Xiwang past, Mr. Aviation for the delivery of clues! CTOnews.com, September 19, according to a press release on Intel's website, Intel recently launched a glass substrate for the next generation of advanced packaging. Babak Sabi, senior vice president and general manager of assembly and test development of Intel, said, "this innovation has taken more than a decade of research to improve."

Intel CTOnews.com noted from the article that compared with modern organic substrates, the glass substrate has "better thermal, physical and optical properties" and can increase the interconnection density by 10 times. The glass substrate can also withstand higher operating temperatures and reduce pattern distortion by 50% through enhanced flatness, thus increasing the focus depth of lithography and providing designers with more flexibility in power transmission and signal wiring.

Thanks to the above features, the enhanced glass substrate can improve assembly yield and reduce waste, thus enabling chip designers to package more chips (or chip units) in a smaller size of a single package. at the same time minimize cost and power consumption.

Intel said it had been a "leader in the semiconductor industry" for decades. In the 1990s, the chipmaker took the lead in the transition from ceramic packaging to organic packaging and introduced halogen-free and lead-free packaging.

Intel also claims that the next generation of glass substrates will initially be used in applications that require larger packages, such as business aspects involving data centers and artificial intelligence. The company expects to provide complete glass substrate solutions after 2025 and is expected to achieve 1 trillion transistors in packaging by 2030.

Referenc

Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute

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