Shulou(Shulou.com)11/24 Report--

CTOnews.com, September 18 (Xinhua)-- Nvidia has approached Samsung about the 3nm GAA process, and if all goes well, mass production is scheduled for 2025, according to industry source @ Mobile Chip.

Hardwaretimes has previously reported that the next generation of Nvidia's flagship graphics card RTX 5090 will use 3nm technology and is expected to be launched by the end of next year.

Nvidia RTX 40 series graphics card code name Ada Lovelace, while the next generation RTX graphics card code name Blackwell, the number of transistors will be more than 15 billion, density will be close to 300 million / mm ², core clock will exceed 3 Ghz, bus density will reach 512 bits.

According to earlier leaked information from foreign media Club 5090, GB102-based RTX 5090 contains 144sets of SM units, that is, 18432 CUDA (assuming each group of SM is still 128MB), which is 12.5% more than RTX 4090 with 96MB second-level cache, matches GDDR7 video memory (384bit bit width), and supports PCIe 5.0x16.

CTOnews.com has reported that MSI also demonstrated the heat dissipation design of the next-generation Nvidia RTX flagship graphics card at the Taipei Computex computer Show.

As can be seen from the picture, the microstar uses dynamic bimetallic fins (Dynamic Bimetallic Fin), six penetrating pure copper heat pipes and large area aluminum fins are also embedded in copper fins to further enhance the heat dissipation, and there are corresponding copper sheets in the visual memory area, which shows that if nothing unexpected, the next generation graphics card will focus on the design of heat dissipation.

▲ image source Club 386

▲ image source Club 386 combined with the information exposed today, combined with such heat dissipation conditions, the original power consumption and heating of RTX 5090 should be impressive.

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