Shulou(Shulou.com)11/24 Report--

CTOnews.com September 14, 2014--Semi Semiconductor Equipment (Shanghai) Co., Ltd. today announced the launch of a "negative pressure cleaning platform" to meet the unique needs of flux removal for core particles and other 3D advanced packaging structures.

According to reports, removing the flux used after reflow soldering is part of the advanced packaging process, and Shengmei Shanghai's Ultra C v negative pressure cleaning platform can meet this unique requirement.

The size of the equipment is shrinking, and the traditional high water pressure joint flushing under atmospheric pressure is no longer applicable. By developing a product that can be cleaned under vacuum conditions, surface hydrophilicity can be improved, allowing fluids to flow in extremely narrow spaces, thus completely removing flux residues in a reasonable time. For products with a very high degree of flux impregnation, a saponification agent can also be added to achieve the purpose of thorough cleaning.

Shengmei Shanghai said that the new product was developed by Shengmei Shanghai in cooperation with several major customers. After cleaning, it can be free of flux residue. It has received a purchase order for this product from a large Chinese manufacturer and is expected to be delivered in the first quarter of next year.

CTOnews.com Shanghai official website introduction:

Shengmei Shanghai was founded in 2005. It is an integrated circuit equipment enterprise introduced by Shanghai City Government through science and education. It is a semiconductor equipment manufacturer with world advanced technology.

Shengmei Shanghai integrates R & D, design, manufacturing and sales to provide high-end semiconductor equipment to customers around the world. The main products are single wafer and tank wet cleaning equipment, electroplating equipment, stress-free polishing equipment, vertical furnace equipment, pre-channel coating development equipment and PECVD equipment.

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