Shulou(Shulou.com)11/24 Report--

CTOnews.com Sept. 13, Guo Mingyi issued an analysis newsletter today, briefly analyzing the motivation behind TSMC's investment in ARM and IMS, believing that these two investments are aimed at improving the ability of vertical integration and ensuring a smooth transition from 3nm's FinFET technology to 2nm's GAA technology.

The original text of Guo Mingfu is attached to CTOnews.com as follows:

I think the main purpose of TSMC's two investments is to improve the ability of vertical integration to ensure a smooth transition from the current 3 nm FinFET technology to 2 nm GAA technology.

Intel will use the 18A process (equivalent to Taiwan SMC's 2nm process) to produce ARM's own chips, which may be one of the reasons why TSMC needs to invest more actively in ARM. TSMC can help optimize ARM IP in TSMC's advanced process and packaging technology by investing in ARM and working more closely together (such as DTCO and STCO).

Apple and Nvidia are likely to use 2nm technology to produce iPhone processors and B100 next-generation AI chips in 2026 at the earliest. As these two potential 2nm customers also invest in ARM, TSMC's investment in ARM is conducive to strengthening cooperation with Apple and Nvidia and winning 2nm orders.

Investment in IMS can ensure that the technical development and supply of key equipment can meet the commercial needs of 2nm.

Intel issued a press release today that it has agreed to sell about 10 per cent of its IMS Nanofabrication business to chip contract manufacturer TSMC.

In addition, TSMC held an interim board meeting on September 12, at which it was confirmed that it would subscribe for Arm common shares of Japan's Softbank Corp. Group within a quota of no more than US $100 million. As for the subscription price, TSMC said it would depend on the final price of the initial public offering of Arm, which is expected to be listed on Nasdaq this week.

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