Shulou(Shulou.com)11/24 Report--

CTOnews.com September 11 news, silicon photons and common packaging optical elements (CPO) has become a new prominent study in the industry, it is rumored on the network that SMC will jointly develop with Broadcom, Huida and other major customers, and will begin to usher in a big order in the second half of next year at the earliest.

According to Taiwan's Economic Daily, TSMC said it would not respond to customers and product conditions for related rumors. However, TSMC is highly optimistic about silicon photonic technology. Yu Zhenhua, vice president of TSMC, said publicly a few days ago: "if we can provide a good silicon photon integration system, we can solve the two key issues of energy efficiency and AI computing power. This will be a new paradigm shift. We may be at the beginning of a new era."

CTOnews.com noted that TSMC, Intel, Huida, Broadcom and other international semiconductor companies have launched the layout of silicon photonic and common packaging optical components technology, and explosive growth in the overall market can be seen as soon as 2024.

According to industry analysis, pluggable optical elements are still used in high-speed data transmission. With the rapid development of transmission speed and entering the 800G generation, and entering higher transmission rates such as 1.6T to 3.2T in the future, power loss and heat dissipation management will be the biggest problem.

Silicon photonic technology uses laser beam instead of electronic signal to transmit data, and is integrated into a single module through CPO packaging technology. it has been certified by Microsoft, Meta and other big companies and adopted in the new generation network architecture.

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