Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens for the delivery of clues on the way! CTOnews.com Sept. 6 news, Nikon announced the launch of a new generation of i-line stepper lithography machine "NSR-2205iL1" with 5 times reduced projection magnification, which is expected to be available in the summer of 2024.

It is said that this lithography machine has a reduced projection amplification system, supports a variety of products such as power semiconductors, communication semiconductors and MEMS, and is highly compatible with Nikon's existing i-line exposure equipment; NSR-2205iL1 represents the most significant update of Nikon's 5x step technology in the past 25 years, and will directly respond to customer demand for these lithography systems, which play an important role in chip manufacturing.

Nikon said that compared with the existing Nikon i-line exposure system, NSR-2205iL1 has excellent economy and can optimize the production of various semiconductor devices regardless of wafer materials.

CTOnews.com Note: this is the first time in 25 years that Nikon has introduced a new i-line exposure system in which the projection ratio has been reduced by 5 times for the first time since "NSR-2205i14E2" began to receive orders in 1999.

Main performance: resolution ≤ 350nmNA (aperture) 0.45light source i-line (wavelength: 365nm) reduction magnification 1:5 maximum exposure field 22 × 22mm stacking accuracy SMO: ≤ 70nm

Nikon points out that with the popularity of electric vehicles, high-speed communications and various IT devices, the demand for semiconductors to support these applications is growing exponentially. These semiconductors must perform a variety of challenging functions, so equipment manufacturers need specialized substrates and exposure systems to manufacture these chips.

In addition to expanding various functional options to meet the diverse needs of customers, the newly developed i-line lithography machine will also support long-term equipment production.

According to reports, NSR-2205iL1 can provide high productivity for various semiconductor manufacturing processes and optimize output levels on the basis of high-precision wafer measurement through a variety of advantages, such as multi-point autofocus (AF), advanced wafer leveling technology and wide depth focus range (DOF). In addition, due to its wafer thickness and size compatibility, high wafer warping tolerance and flexible features (including, but not limited to, support for SiC (Silicon Carbide) and GaN (Gallium Nitride) processing), NSR-2205iL1 i-line lithography is ideal for a variety of application scenarios. This lithography machine will provide excellent performance-to-price ratio while meeting the diversified needs of chip manufacturers.

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