Shulou(Shulou.com)11/24 Report--

CTOnews.com, September 5 (Xinhua)-- Intel cancelled its planned $5.4 billion acquisition of Tower Semiconductor two weeks ago due to opposition from Chinese regulators, but that didn't stop the two companies from working together. Intel announced today that it will provide wafer foundry services and 300mm chip manufacturing capacity for High Tower Semiconductor.

Under the agreement, Tower will use an Intel plant in New Mexico, operated by Intel Foundry Services (IFS), and invest up to $300 million to "purchase and own equipment and other fixed assets" that will be installed in manufacturing facilities. The agreement, which will provide a new capacity channel for High Tower to produce 300mm chips with "more than 600000 photo layer" per month, to meet expected demand, means that Intel will produce 65nm power management BCD for High Tower. High Tower Semiconductor itself has its own manufacturing facilities in Israel (150mm and 200mm), the United States (200mm), Japan (200mm and 300mm) and the upcoming cooperation with Italy's STMicroelectronics.

In the past year, Intel contract manufacturing services have indeed made great progress. Revenue from Intel's contract manufacturing business was $232 million in the second quarter, up more than 300% from a year earlier. Intel aims to become the world's second-largest external contract manufacturer by 2030.

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