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2025-04-02 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >
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Shulou(Shulou.com)11/24 Report--
Thank you, Mr. Air, a netizen of CTOnews.com, for your clue delivery! CTOnews.com, September 1 (Xinhua)-- Bosch will complete its acquisition of American chipmaker TSI Semiconductors this week, according to an interview with Bloomberg. It is understood that the company, located in Roswell, California, has 250 employees and is a contract manufacturer of application-specific integrated circuits (ASIC).
CTOnews.com noted that TSI Semiconductors mainly develops and produces a large number of 8-inch silicon chips for use in the mobile, telecommunications, energy and life sciences industries. Over the next few years, Bosch plans to invest more than $1.5 billion in the Roswell plant and transform its TSI Semiconductors manufacturing facility into a state-of-the-art process. Starting in 2026, the first chips will be produced on 8-inch wafers based on the innovative material silicon carbide (SiC).
In this way, Bosch is systematically strengthening its semiconductor business and will significantly expand its global portfolio of SiC chips by the end of 2030.
"through the acquisition of TSI Semiconductors, we are building SiC chip manufacturing capacity in an important sales market, while also increasing our semiconductor manufacturing worldwide. Roswell's existing clean room facilities and experts will enable us to manufacture SiC chips for electric vehicles on a larger scale." Said Dr. Stefan Hartung, chairman of the Bosch management committee.
Roswell's new plant will strengthen Bosch's international semiconductor manufacturing network. Starting from 2026, after the reorganization phase, the first SiC chips will be produced on 8-inch wafers. Bosch invested in the R & D and production of SiC chips in the early days. Since 2021, the company has been using its own process for mass production at the Royt Lingen plant near Stuttgart.
By the end of 2025, the company will expand the clean room area of Reuitlingen from about 35000 square meters to more than 44000 square meters. "the SiC chip is a key component of electric vehicles. By expanding our semiconductor business internationally, we will strengthen our local influence in the important electric vehicle market." Said Dr. Markus Heyn, member of the Bosch Management Committee and chairman of the mobile solutions business unit.
By 2025, Bosch expects to integrate an average of 25 chips in each new car.
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