Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com August 23 news, according to foreign media hankyung news, AMD has reached an agreement with Samsung Electronics, Samsung's HBM3 memory and packaging technology will be adopted by AMD MI300X GPU, foreign media expect Samsung Electronics to get 50% of the HBM market next year.

When SMC steps down, it is heavily occupied by Nvidia's huge AI GPU orders, which makes it difficult for companies such as AMD to entrust TSMC, so AMD needs to find another reliable and consistent partner-Samsung.

▲ source foreign media hankyung is reported that Samsung has passed the decisive quality test of its next-generation HBM3 memory and is ready to include AMD. Foreign media claimed that Samsung proposed a "hybrid" manufacturing process to Nvidia, such as the purchase of 2.5D wafers.

CTOnews.com also found that in addition to AMD, Nvidia also sees Samsung as a potential supplier, saying that "TSMC is currently unable to meet the huge demand of the AI industry, and delivery time has been extended by six months." With the disruption of the supply chain, profits will also be affected, Nvidia's goal is to "maximize its production", which is "unbearable".

The ▲ map source AMDAMD MI300X has up to 8 XCD cores, 304sets of CU units, and 8 groups of HBM3 cores. The video memory capacity has been increased to 192GB, which is equivalent to 2.4x of NVIDIA H100 80GB. At the same time, the HBM memory bandwidth is up to 5.2TB / 5.2TB Infinity Fabric bus bandwidth also has 896GB/s, which also exceeds that of Nvidia H100.

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