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2025-01-19 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >
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Shulou(Shulou.com)11/24 Report--
CTOnews.com August 21, SK Hynix today issued a press release announcing the successful development of HBM3E, a new ultra-high performance DRAM product for AI, and began to provide customers with samples for performance verification.
▲ source SK Hynix official website, the same as CTOnews.com note: HBM (High Bandwidth Memory) refers to the vertical connection of multiple DRAM, which can significantly improve the speed of data processing. HBM DRAM products are developed in the order of HBM (first generation), HBM2 (second generation), HBM2E (third generation), HBM3 (fourth generation) and HBM3E (fifth generation). HBM3E is an extended (Extended) version of HBM3.
SK Hynix said: "based on the only experience in mass production of HBM3, the company has successfully developed the world's highest performance extended version of HBM3E. And with the industry's largest HBM supply experience and mass production maturity, it will start mass production of HBM3E in the first half of next year to consolidate its unique position in the AI-oriented memory market."
According to reports, in terms of speed, the product can handle 1.15TB (terabyte) data at most per second. It is equivalent to processing 230full high definition (Full-HD,FHD) movies (5 gigabytes, 5GB) in 1 second.
At the same time, the SK Hynix technical team has adopted the latest Advanced MR-MUF technology on the product, and its heat dissipation performance is 10% higher than that of the previous generation. HBM3E also has backward compatibility (Backward compatibility), so customers can directly adopt new products in HBM3-based systems without modifying their design or structure.
"Nvidia has a long-standing partnership with SK Hynix for HBM used in the state-of-the-art accelerated computing solution (Accelerated Computing Solutions)," said Ian Buck, vice president of Hyperscale and HPC. "to showcase the new generation of AI computing, we look forward to the continued cooperation between the two companies in the HBM3E field."
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