Shulou(Shulou.com)11/24 Report--

CTOnews.com, August 15, according to ETNews, Jung Ki-tae Jung, chief technical officer of Samsung Electronics contract Manufacturing Department, announced at a recent forum that "We plan to apply BSPDN to the 1.4 nm process in 2027."

Back Power supply (BSPDN) technology is an innovative technology applied to advanced semiconductors, which aims to better tap the potential of the space on the back of the wafer, but it has not been implemented on a global scale. This is also the first time that Samsung Electronics has disclosed its BSPDN development process.

Although the semiconductor industry no longer uses gate length and metal half-pitch to name technology nodes systematically, there is no doubt that the smaller the number, the more advanced the current process technology.

As the miniature route of semiconductor technology continues to move forward, the distance between circuits in integrated circuits continues to narrow, resulting in interference to each other, and BSPDN technology can overcome this limitation, because we can use the back of the wafer to build power supply lines to separate circuits and power space.

Tuyuan Pexels is not only Samsung Electronics, TSMC and Intel and other manufacturers are also actively seeking technological breakthroughs, and Japan's Tokyo Electronics (TEL) and Austria's EV Group (EVG) are providing BSPDN implementation equipment.

At present, Intel's back power supply technology, called PowerVia, is designed to reduce power consumption, improve efficiency and performance, while the next Intel 20A will be Intel's first node using PowerVia technology and RibbonFET full-surround gate transistors, which is expected to be ready in the first half of 2024 and will be used in the future mass production Arrow Lake platform (CTOnews.com Note: there is a probability of delay). It is currently starting step (First Stepping) in the fab.

In addition, TSMC plans to apply similar technologies to the following 2nm processes, with the goal expected to be achieved by 2026.

Samsung Electronics BSPDN technology goal is to be used in the 1.4nm process in 2027, but may be delayed according to market demand.

Samsung Electronics sources said: "the mass production time of semiconductors with back power supply technology may change according to the customer's schedule." Samsung Electronics aims to mass-produce the 2nm process by 2025, ahead of the 1.4nm process. It is said that Samsung is currently conducting a customer demand survey on the application of back power supply technology.

Related readings:

Intel introduces the latest PowerVia rear power supply technology: reducing power consumption, improving efficiency and performance.

Samsung uses BSPDN technology in 2nm chips to further improve 44% performance and 30% efficiency.

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