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Ji Bang Consulting estimates that HBM memory shipments will grow by 105% next year. Together, Hynix and Samsung account for about 95%.

2025-02-27 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >

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Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com August 10 news, set Consulting (TrendForce) recently released a report, saying that under the addition of chips developed by Nvidia and other cloud service providers (CSP), memory manufacturers are actively expanding TSV production lines to increase HBM production capacity. It is estimated that HBM shipments will increase by 105% in 2024.

The report points out that mainstream demand has shifted from HBM2e to HBM3 in 2023, and the proportion of demand is estimated to be about 50% and 39% respectively.

With the gradual release of accelerated chips using HBM3, the market demand will shift significantly to HBM3 in 2024, and it will directly surpass HBM2e in 2024, accounting for 60% of the estimated proportion, and thanks to its higher average sales unit price (ASP), HBM revenue will grow significantly next year.

In terms of competition, SK Hynix (SK hynix) HBM3 products are ahead of other original manufacturers and are the main suppliers of NVIDIA Server GPU.

Samsung (Samsung) focuses on meeting orders from other cloud service providers, and the market share gap with SK Hynix will narrow sharply this year under customer orders. The two companies' HBM market share is expected to be equal in 2023-2024, with a combined market share of about 95% of the HBM market.

Micron has focused on developing HBM3e products this year, and its market share is expected to decline slightly this year and next due to crowding out, compared with the plans of the two South Korean factories to expand production significantly.

The original report is attached to CTOnews.com, which can be read by interested users.

HBM refers to high-bandwidth memory, which is a high-performance DRAM based on 3D stacking process initiated by Samsung Electronics, Ultra Micro Semiconductor and SK Hynix. It is suitable for applications with high memory bandwidth requirements, such as graphics processors, network switching and forwarding devices (such as routers, switches).

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