Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens for the delivery of clues about the past. CTOnews.com, August 9, according to a report in Taiwan's Economic Daily, TSMC announced yesterday that in response to the strong market demand for advanced processes, the Kaohsiung plant has decided to use 2nm advanced process technology production planning.

At the meeting in April, TSMC confirmed that the Kaohsiung plant had adjusted the 28nm production line to more advanced process technology, but did not mention what process to change at that time. TSMC's current 2nm production base has been planned for bamboo and Zhongke. If Kaohsiung is included in the future, the company will have three 2nm production bases.

In addition, according to Taiwan's "Central News Agency", TSMC plans to produce a 2nm process in 2025, using a nano-wafer transistor structure. At the same time, TSMC has developed a back rail solution at 2 nm, which is suitable for high-performance computing-related applications, with the goal of launching in the second half of 2025 and production in 2026.

▲ TSMC website as previously reported by CTOnews.com, TSMC also announced yesterday that it and Robert Bosch (Robert Bosch GmbH), Infineon Technology (Infineon Technologies AG) and NXP Semiconductors NV Semiconductor (NXP Semiconductors NV) will jointly invest in European Semiconductor Manufacturing Company (ESMC) in Dresden, Germany, with a total investment estimated to exceed 10 billion euros to provide advanced semiconductor manufacturing services.

The fab, scheduled for construction in the second half of 2024 and production by the end of 2027, will be operated by TSMC, which will be 70 per cent owned by TSMC and 10 per cent each owned by Bosch, Infineon and NXP. After completion, it is expected to produce 40000 (12-inch) 300mm wafers per month, using TSMC's 28pm 22nm CMOS and 16max 12nm FinFET technology.

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