Shulou(Shulou.com)11/24 Report--

According to CTOnews.com, August 3, diamond (the raw stone of diamond) is one of the promising materials in the semiconductor industry, but it has not been used on a large scale because of the challenge of cutting it into thin wafers.

A breakthrough in a new laser slicing technology known as diamond semiconductors, which uses laser pulses to cut diamond into thin slices, was posted on the website of Chiba University in Japan on Tuesday. It is said to "pave the way for the next generation of semiconductor materials".

A research team at Chiba University has developed a new laser-based technology that claims to "cut diamond effortlessly along the best crystal plane", which can be used for efficient power conversion and high-speed communication technology for electric vehicles.

According to the official website of Chiba University in Japan, the properties of most crystals, including diamond, change along different crystal planes, which are imaginary surfaces containing the atoms that make up the crystal. Although people can easily cut diamond along the surface. However, cracks will occur along the cleavage surface during cutting, which increases the notch loss, so it can not be used for slicing.

The research team at Chiba University adopted a new method. Although the laser will not cut the diamond into a wafer grid, "concentrated laser irradiation will convert the diamond into amorphous carbon with a lower density than diamond." The resulting low-density grid lines in the diamond structure provide a predefined fracture surface for crack propagation.

The researchers say that once the diamond is treated above, it is easy to separate regular-shaped diamond wafers and prepare for subsequent manufacturing work.

Professor Hirofumi Hidai of Graduate School of Engineering at Chiba University said: "Diamond chips can produce high-quality wafers at low cost, which is essential for the manufacture of diamond semiconductor devices."

At present, the result has been published in Diamond & Related Materials, and interested CTOnews.com partners can check it out.

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