Patent data show that TSMC is in a leading position in the advanced chip packaging war.

CTOnews.com Aug. 2-According to patent data from LexiNexis, TSMC leads its competitors in advanced chip packaging technology, followed by Samsung Electronics of South Korea and Intel of the United States. Advanced chip packaging technology is a key technology that can improve chip performance and is crucial for manufacturers competing for chip foundry business.

According to data and analytics firm LexisNexis, TSMC holds 2946 advanced chip package patents and has the highest quality, a metric that includes the number of times patents are cited by other companies. Samsung Electronics ranked second in terms of patent quantity and quality, with 2404 patents. Intel ranked third with 1434 patents.

As it becomes increasingly difficult to integrate more transistors on a single silicon wafer, advanced chip packaging technology is critical to improving semiconductor design. The technology allows the industry to stack or splice multiple chips, known as "chiplets," in the same container.

Samsung Electronics has been investing in advanced chip packaging technology for many years and set up a dedicated team to develop the technology in December 2022, Moonsoo Kang, head of the team, said in a statement.

CTOnews.com notes that Intel denies that the size of TSMC's patent portfolio indicates it has more advanced technology, Benjamin Ostapuk, vice president of the company's intellectual property legal group, said in a statement that the company's patents protect its intellectual property and that its patent investments are carefully selected.

Tsmc declined to comment.