Shulou(Shulou.com)11/24 Report--

CTOnews.com, July 31, according to Taiwanese media MoneyDJ, citing industry sources, Apple is producing the latest 3D stacking technology SoIC (system Integration Chip) in small quantities after AMD. It is currently planned to use SoIC with InFO packaging scheme, which is expected to be used in MacBook, and there will be a chance to see terminal products coming out as soon as 2025-2026.

According to CTOnews.com, TSMC SoIC is the industry's first high-density 3D stacking technology. Through Chip on Wafer (CoW) packaging technology, grains of different sizes, functions and nodes can be heterogeneously integrated and put into mass production in Zhunan No. 6 Plant (AP6). Among them, AMD is the first customer, and its latest MI300 is SoIC with CoWoS.

Industry insiders said that unlike AMD, Apple plans to use SoIC with InFO solution, mainly based on product design, positioning, cost and other comprehensive considerations. If SoIC successfully introduces bulk consumer electronics in the future, it is expected to create more demand and capacity, and greatly enhance the willingness of other major customers to import. At present, SoIC technology is still in its infancy, with a monthly production capacity of nearly 2000 tablets, and it is expected to continue to double its growth in the next few years.

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