Shulou(Shulou.com)11/24 Report--

CTOnews.com July 28, according to the Taiwan media "Economic Daily" reported that Hon Hai Group Semiconductor Strategy Director Jiang Shangyi said today that artificial intelligence Internet of things (AIoT) applications are changing the semiconductor industry and market, small chip (chiplet) integration technology will be one of the main trends in the post-Moore era, heterointegration (heterogeneous integration) advanced packaging technology can enhance system efficiency and power consumption.

▲ Tuyuan PexelsCTOnews.com previously reported that the annual Indian Semiconductor Conference (Semicon India 2023) was held in Gandinagar, India on July 25-30, and Hon Hai Chairman Liu Yangwei personally attended the speech. Jiang Shangyi delivered a speech at the meeting today on the theme of "opportunities and challenges in the post-Moore semiconductor era".

Jiang Shangyi believes that Moore's Law has reached the physical limit. Due to the increased cost of semiconductor design and innovation, the cost of using semiconductor advanced technology below 4nm is high, and only a small number of large products can afford advanced chip process technology. He said that the previous system design and segmentation technology has been unable to meet the needs of diversified applications, packaging and PC board technology lags far behind silicon wafers, becoming the bottleneck of system performance.

Jiang Shangyi pointed out that in the era of Internet of things and AI Internet of things, chip demand is more diversified, diversity and flexibility are needed, both ecosystems are still unable to provide the best solution, and Internet of things and AI Internet of things applications are also changing the semiconductor industry and market.

Looking at post-Moore technology, Jiang Shangyi believes that integrated chips (integrated chips) will become one of the trends. He pointed out that from the perspective of system design, various hardware functions can be divided into small chips, various small chips can be manufactured through different IC technology nodes, and even use non-silicon materials to meet low cost and efficiency requirements, and various small chips can be further integrated to meet system functions.

Jiang Shangyi also said that advanced packaging technology can enhance system efficiency and power consumption, modularization trends are more flexible, design scale and innovation capabilities, making semiconductor design customization simpler and cheaper, and it can also enable different materials and different generations of technologies to achieve better efficiency and reduce costs through heterogeneous integration.

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