Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens Wu Yanzu in South China for the delivery of clues! CTOnews.com July 26 news, according to Tom's Hardware, Micron announced today that its HBM3 Gen 2 memory is providing customers with samples.

Meguiar says its HBM3 Gen 2 memory is the fastest in the world, with an aggregate bandwidth of 1.2 TB / s and a high stack capacity of 24GB. There will be 12 high-stack versions in the future, with a capacity of up to 36GB. Meguiar says its new memory is the most energy efficient, with 2.5 times the performance per watt compared to the company's previous generation of HBM2E.

Meguiar is reported to be the first company to offer second-generation HBM3 memory samples, surpassing competitors such as SK Hynix and Samsung.

In terms of naming, Meguiar's HMB3 Gen 2 memory is not named "HBM3E" according to Meguiar's previous naming convention. Meguiar said the new "Gen2" naming represented an intergenerational leap in performance, capacity and energy efficiency.

Meguiar announced the latest memory roadmap, marked with "HBMNext" memory, launched around 2026, capacity up to 36-64GB, can provide 2 + TB / s bandwidth.

According to reports, Meguiar's new HBM3 Gen 2 memory uses eight stacked chips (8 high), which increases the capacity by 50% compared with other 8 high HBM3 memory. In addition, Meguiar's new memory is also suitable for the same 11mmx11mm package as the standard HBM3, compatible with existing HBM3 pins, and relatively easy to replace memory.

The bandwidth of Meguiar's HBM3 Gen 2 memory 8 high stack has been increased by 50%, and the transmission speed of each pin can reach 1.2 TB / s when the transmission speed is 9.2 Gbps,1024bit bit width.

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