Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen OC_Formula for clue delivery! CTOnews.com July 25 news, before there was news that the Bamboo Science Administration, considering the urgency of TSMC's construction, decided to allocate a large area of land to TSMC to build an advanced packaging plant, so as to facilitate TSMC's accelerated expansion of CoWoS capacity demand.

TSMC officially confirmed today that it will spend NT $90 billion (CTOnews.com Note: Currently about RMB 20.61 billion) to build an advanced packaging plant in Tongluo Township, Miaoli County in response to the demand of NVIDIA, AMD and other manufacturers for advanced packaging such as AI chip CoWoS.

TSMC said this morning that the Hsinchu Science Park Administration has agreed to allocate 7 hectares of land and is scheduled to complete the plant by the end of 2026 and mass production in the third quarter of 2027. This will be TSMC's sixth packaging production base after Longtan, Zhunan and Nanke.

In fact, TSMC announced the official opening of Zhunan Advanced Packaging Test Plant 6 (AP6) last month, which is a major milestone for TSMC Advanced Packaging.

TSMC further expanded its advanced packaging operations, revealing that TSMC not only holds a large number of advanced logic chip manufacturing orders, but also simultaneously packages most advanced packaging orders.

Wei Zhejia, president of TSMC, admitted at the law conference on July 20 that the increase in AI-related demand is a positive trend for TSMC. It is predicted that it will grow at an average annual growth rate of nearly 50% in the next five years and account for about 10% of TSMC's revenue. TSMC has also decided to emphasize the construction of advanced packaging capacity in CoWoS in capital expenditure, and the sooner the better!

It is worth mentioning that this land was originally the base land contested by LSMC and the world. After the Bamboo Science Administration Bureau gave up the land that had not yet started the plant construction plan and was leased by TSMC instead.

According to the plan proposed by TSMC, TSMC estimates that the Tongluo Plant will start land preparation in the fourth quarter of 2023, start construction in the second half of 2024, and complete construction in 2026. It will strive to start mass production in the first half of 2027 and at the latest in the third quarter. The monthly production capacity of 110,000 12-inch wafers will create 1500 jobs after completion.

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